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7540 Group User’s Manual
ix
List of figures
Fig. 3.2.16 V
CC
-V
IHL
characteristics (I/O port (CMOS): Mask ROM version)........................3-37
Fig. 3.2.17 V
CC
-V
IHL
characteristics (I/O port (TTL): Mask ROM version) ............................3-37
Fig. 3.2.18 V
CC
-V
IHL
characteristics (RESET pin: Mask ROM version) .................................3-38
Fig. 3.2.19 V
CC
-V
IHL
characteristics (X
IN
pin: Mask ROM version) .........................................3-38
Fig. 3.2.20 V
CC
-V
IL
characteristics (CNV
SS
pin: Mask ROM version).....................................3-38
Fig. 3.2.21 V
CC
-HYS characteristics (RESET pin: Mask ROM version)................................3-39
Fig. 3.2.22 V
CC
-HYS characteristics (SIO pin: Mask ROM version)......................................3-39
Fig. 3.2.23 V
CC
-HYS characteristics (INT pin: Mask ROM version) ......................................3-39
Fig. 3.2.24
V
OH
-I
OH
characteristics of P-channel (V
CC
= 3.0 V, normal port: Mask ROM version) ..
3-40
Fig. 3.2.25
V
OH
-I
OH
characteristics of P-channel (V
CC
= 5.0 V, normal port: Mask ROM version) ..
3-40
Fig. 3.2.26
V
OL
-I
OL
characteristics of N-channel (V
CC
= 3.0 V, normal port: Mask ROM version)...
3-41
Fig. 3.2.27
V
OL
-I
OL
characteristics of N-channel (V
CC
= 5.0 V, normal port: Mask ROM version)...
3-41
Fig. 3.2.28 V
OL
-I
OL
characteristics of N-channel (V
CC
= 3.0 V, LED drive port: Mask ROM version)
.................................................................................................................................................3-42
Fig. 3.2.29 V
OL
-I
OL
characteristics of N-channel (V
CC
= 5.0 V, LED drive port: Mask ROM version)
.................................................................................................................................................3-42
Fig. 3.2.30 V
CC
-IIL characteristics (Port “L” input current when connecting pull-up transistor:
Mask ROM version) ..............................................................................................................3-43
Fig. 3.2.31 V
IN
-II(AD) characteristics (A-D port input current during A-D conversion, f(X
IN
) = 8
MHz in high-speed mode: Mask ROM version)................................................................3-44
Fig. 3.2.32 V
IN
-II(AD) characteristics (A-D port input current during A-D conversion, f(X
IN
) = 6
MHz in double-speed mode: Mask ROM version)............................................................3-44
Fig. 3.2.33 V
IN
-II(AD) characteristics (A-D port input current during A-D conversion, f(X
IN
) = 4
MHz in double-speed mode: Mask ROM version)............................................................3-44
Fig. 3.2.34 V
CC
-R
OSC
characteristics (ring oscillator frequency: Mask ROM version)..........3-45
Fig. 3.2.35 Ta-R
OSC
characteristics (ring oscillator frequency: Mask ROM version)...........3-45
Fig. 3.2.36 R-f(X
IN
) characteristics (RC oscillation frequency: Mask ROM version)...........3-46
Fig. 3.2.37 C-f(X
IN
) characteristics (RC oscillation frequency: Mask ROM version)...........3-46
Fig. 3.2.38 V
CC
-f(X
IN
) characteristics (RC oscillation frequency: Mask ROM version) ........3-47
Fig. 3.2.39 Ta-f(X
IN
) characteristics (RC oscillation frequency: Mask ROM version) .........3-47
Fig. 3.2.40 Definition of A-D conversion a
CC
uracy...................................................................3-48
Fig. 3.2.41
A-D conversion accuracy typical characteristic example-1 (Mask ROM version) ..
3-49
Fig. 3.2.42
A-D conversion accuracy typical characteristic example-2 (Mask ROM version) ..
3-50
Fig. 3.2.43
A-D conversion a
CC
uracy typical characteristic example-3 (Mask ROM version)..
3-51
Fig. 3.2.44 V
CC
-I
CC
characteristics (in double-speed mode: One Time PROM version) .....3-52
Fig. 3.2.45 V
CC
-I
CC
characteristics (in high-speed mode: One Time PROM version) .........3-52
Fig. 3.2.46 V
CC
-I
CC
characteristics (in middle-speed mode: One Time PROM version) .....3-52
Fig. 3.2.47
V
CC
-I
CC
characteristics (at WIT instruction execution: One Time PROM version) ..
3-53
Fig. 3.2.48
V
CC
-I
CC
characteristics (at STP instruction execution: One Time PROM version) ..
3-53
Fig. 3.2.49 V
CC
-I
CC
characteristics (addition when operating A-D conversion, f(X
IN
) = 8 MHz in
high-speed mode: One Time PROM version) ...................................................................3-54
Fig. 3.2.50 V
CC
-I
CC
characteristics (addition when operating A-D conversion, f(X
IN
) = 6 MHz in
double-speed mode: One Time PROM version)...............................................................3-54
Fig. 3.2.51 V
CC
-I
CC
characteristics (When system is operating by ring oscillator, Ceramic oscillation
stop: One Time PROM version)..........................................................................................3-55
Fig. 3.2.52 V
CC
-I
CC
characteristics (When system is operating by ring oscillator, at WIT instruction
execution, Ceramic oscillation stop: One Time PROM version) ....................................3-55
Fig. 3.2.53 f(X
IN
)-I
CC
characteristics (in double-speed mode: One Time PROM version) ..3-56
Fig. 3.2.54 f(X
IN
)-I
CC
characteristics (in high-speed mode: One Time PROM version) ......3-56
Fig. 3.2.55 f(X
IN
)-I
CC
characteristics (in middle-speed mode: One Time PROM version) ..3-56
Fig. 3.2.56 f(X
IN
)-I
CC
characteristics (at WIT instruction execution: One Time PROM version) ...3-57
Fig. 3.2.57 Ta-I
CC
characteristics (When system is operating by ring oscillator, Ceramic oscillation
stop: One Time PROM version)..........................................................................................3-57