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參數(shù)資料
| 型號： | 403GC-3BA25C1 |
| 元件分類： | 復(fù)位半導(dǎo)體 |
| 英文描述： | 300mA LDO Linear Regulators with Internal Microprocessor Reset Circuit |
| 中文描述： | 32位微處理器 |
| 文件頁數(shù)： | 21/48頁 |
| 文件大小： | 768K |
| 代理商： | 403GC-3BA25C1 |
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IBM PowerPC 403GC
21
Package Thermal Specifications
The 403GC is designed to operate within the
case temperature range from -40°C to 120°C.
Thermal resistance values are shown in Table 7:
Table 7. Thermal Resistance (°C/Watt)
Notes:
1. Case temperature Tm
C
is measured at top center of
case surface with device soldered to circuit board.
2. Tm
A
= Tm
C
– P
×θ
CA
, where Tm
A
is ambient
temperature.
3. Tm
CMax
= Tm
JMax
– P
×θ
JC
, where Tm
JMax
is
maximum junction temperature and P is power
consumption.
4. The above assumes that the chip is mounted on a
card with at least one signal and two power planes.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
The absolute maximum ratings in Table 8 below
are stress ratings only. Operation at or beyond
these maximum ratings may cause permanent
damage to the device.
Table 8. 403GC Maximum Ratings
Operating Conditions
The 403GC can interface to either 3V or 5V
technologies. The range for supply voltages is
specified for five-percent margins relative to a
nominal 3.3V power supply.
Device operation beyond the conditions specified
in Table 9 is not recommended. Extended
operation beyond the recommended conditions
may affect device reliability:
Table 9. Operating Conditions
Note:
1. These frequencies do not account for T
CS
. See
Table 12.
Power Considerations
Power dissipation is determined by operating
frequency, temperature, and supply voltage, as
well as external source/sink current
requirements. Typical power dissipation is 0.2 W
at 25 MHz, 0.26 W at 33 MHz, or 0.32 W at 40
MHz, Tm
C
= 55 °C, and V
CC
= 3.3 V, with an
average 10pF capacitive load.
Estimated supply current as a function of
frequency is shown in the figure, "Supply Current
vs Operating Frequency," on page 30. Derating
curves are provided in the section, "Output
Derating for Capacitance and Voltage," on page
28.
Recommended Connections
Power and ground pins should all be connected
to separate power and ground planes in the
circuit board to which the 403GC is mounted.
Unused input pins must be tied inactive, either
high or low.
The interface voltage reference (IVR) pin should
connecting to the 403GC pins operate at 3V
levels. If any signal pin connecting to the 403GC
operates with 5V levels, the IVR pin should be
connected to 5V supply.
Parameter
Airflow-ft/min (m/sec)
0
(0)
100
(0.51)
200
(1.02)
θ
JC
Junction to case
θ
CA
Case
to ambient
PQFP (no heatsink)
PBGA (no heatsink)
2
2
2
37.2
30
31.6
29.8
Parameter
Maximum Rating
Supply voltage with
respect to GND
-0.5V to +3.8V
Voltage on other pins with
respect to GND
-0.5V to +5.5V
Case temperature under
bias
-40°C to +120°C
Storage temperature
-65°C to +150°C
Symbol
Parameter
Min Max Unit
V
DD
Supply voltage:
PPC403GC-JA25/33/40
403GC-3BA25/33/40
3.14
3.14
3.47
3.47
V
F
C
Clock frequency
1
:
PPC403GC-JA25/3BA25
PPC403GC-JA33/3BA33
PPC403GC-JA40/3BA40
0
0
0
25
33
40
MHz
Tm
C
Case temperature
under bias:
PPC403GC-JA25/33/40
403GC-3BA25/33/40
-40
-40
85
85
°
C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 403GC-3BA33C1 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| 403GC-3BA40C1 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| 403GCX2JC66C2 | 制造商:IBM 功能描述:38R2233 |
| 403GCX-3BC50C2 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| 403GCX-3BC66C2 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
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