- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1973 > XC56L307VF160 (Freescale Semiconductor)IC DSP 24BIT FIXED POINT 196-BGA PDF資料下載
參數(shù)資料
| 型號： | XC56L307VF160 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 82/104頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DSP 24BIT FIXED POINT 196-BGA |
| 標準包裝： | 126 |
| 系列： | DSP563xx |
| 類型： | 定點 |
| 接口： | 主機接口，SSI，SCI |
| 時鐘速率： | 160MHz |
| 非易失內(nèi)存： | ROM（576 B） |
| 芯片上RAM： | 576kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.80V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 196-LBGA |
| 供應商設(shè)備封裝： | 196-MAPBGA（15x15） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁當前第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁
DSP56L307 Technical Data, Rev. 6
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56L307 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, TJ, in ° C can be obtained from this equation:
Equation 1:
Where:
TA
=
ambient temperature °C
RθJA
=
package junction-to-ambient thermal resistance °C/W
PD
= power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
RθJA
=
package junction-to-ambient thermal resistance °C/W
RθJC
=
package junction-to-case thermal resistance °C/W
RθCA
=
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate. A complicating factor is the existence of three
common ways to determine the junction-to-case thermal resistance in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XC56L307VL160 | IC DSP 24BIT FIXED POINT 196-BGA |
| XC5VLX220T-1FFG1136I | IC FPGA VIRTEX-5 220K 1136FBGA |
| XC5VSX35T-X1FFG665C | IC FPGA VIRTEX 5 35K 665FFGBGA |
| XC6SLX150T-3FG900I | IC FPGA SPARTAN 6 900FGGBGA |
| XC6SLX75T-4FGG676C | IC FPGA SPARTAN 6 74K 676FGGBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC56L307VL150 | 功能描述:IC DSP 24BIT 150MHZ 196-MABGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:DSP563xx 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| XC56L307VL160 | 功能描述:IC DSP 24BIT FIXED POINT 196-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:DSP563xx 標準包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| XC5A0122 | 制造商:Omron Electronic Components LLC 功能描述:CONN DIN 41612 PL 100 POS 2.54MM SLDR RA TH - Bulk 制造商:Omron Electronic Components LLC 功能描述:CONNECTR 100POS RT-ANGL TERM DIN 制造商:Omron Electronic Components LLC 功能描述:Conn DIN 41612 PL 100 POS 2.54mm Solder RA Thru-Hole |
| XC5A-0122 | 功能描述:DIN 41612 連接器 CONNECTOR RoHS:否 制造商:HARTING 系列:har-bus 64 產(chǎn)品類型:Plugs 排數(shù):5 位置/觸點數(shù)量:160 安裝角:Right 類型:Shrouded Header 端接類型:Solder 外殼材料: 觸點材料: 觸點電鍍: |
| XC5A-0122BYOMR | 制造商:Omron Corporation 功能描述:CONN DIN 41612 PL 100 POS 2.54MM SLDR RA TH - Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復。