參數(shù)資料
型號(hào)： XC56L307VF160
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 20/104頁(yè)
文件大?。?/td> 0K
描述： IC DSP 24BIT FIXED POINT 196-BGA
標(biāo)準(zhǔn)包裝： 126
系列： DSP563xx
類型： 定點(diǎn)
接口： 主機(jī)接口，SSI，SCI
時(shí)鐘速率： 160MHz
非易失內(nèi)存： ROM（576 B）
芯片上RAM： 576kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.80V
安裝類型： 表面貼裝
封裝/外殼： 196-LBGA
供應(yīng)商設(shè)備封裝： 196-MAPBGA（15x15）
包裝： 托盤
DSP56L307 Technical Data, Rev. 6
2-2
Freescale Semiconductor
Specifications
2.2 Thermal Characteristics
Table 2-1.
Absolute Maximum Ratings
Rating1
Symbol
Value1, 2
Unit
Supply Voltage
VCC
–0.1 to 2.0
V
Input/Output Supply Voltage
VCCQH
–0.3 to 4.0
V
All input voltages
VIN
GND – 0.3 to VCCQH + 0.3
V
Current drain per pin excluding VCC and GND
I
10
mA
Operating temperature range
TJ
–40 to +100
°C
Storage temperature
TSTG
–55 to +150
°C
Notes:
1.
GND = 0 V, VCC = 1.8 V ± 0.1 V, VCCQH = 3.3 V ± 0.3 V, TJ = –40°C to +100°C, CL = 50 pF
2.
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
3.
Power-up sequence: During power-up, and throughout the DSP56L307 operation, VCCQH voltage must always be higher or
equal to VCC voltage.
Table 2-2.
Thermal Characteristics
Thermal Resistance Characteristic
Symbol
MAP-BGA
Value
Unit
Junction-to-ambient, natural convection, single-layer board (1s)1,2
RθJA
47
°C/W
Junction-to-ambient, natural convection, four-layer board (2s2p)1,3
RθJMA
25
°C/W
Junction-to-ambient, @200 ft/min air flow, single layer board (1s)1,3
RθJMA
37
°C/W
Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)
1,3
RθJMA
22
°C/W
Junction-to-board
4
RθJB
15
°C/W
Junction-to-case thermal resistance5
RθJC
8
°C/W
Junction-to-package-top, natural convection6
Ψ
JT
2
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3.
Per JEDEC JESD51-6 with the board horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
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