參數(shù)資料
型號(hào)： W9812G6JH-6
廠商： WINBOND ELECTRONICS CORP
元件分類(lèi)： DRAM
英文描述： 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54
封裝： 0.400 INCH, ROHS COMPLIANT,TSOP2-54
文件頁(yè)數(shù)： 40/42頁(yè)
文件大?。?/td> 656K
代理商： W9812G6JH-6
W9812G6JH
Publication Release Date: Sep. 08, 2010
- 7 -
Revision A04
7. FUNCTIONAL DESCRIPTION
7.1 Power Up and Initialization
The default power up state of the mode register is unspecified. The following power up and
initialization sequence need to be followed to guarantee the device being preconditioned to each user
specific needs.
During power up, all VDD and VDDQ pins must be ramp up simultaneously to the specified voltage
when the input signals are held in the “NOP” state. The power up voltage must not exceed VDD +0.3V
on any of the input pins or VDD supplies. After power up, an initial pause of 200 S is required followed
by a precharge of all banks using the precharge command. To prevent data contention on the DQ bus
during power up, it is required that the DQM and CKE pins be held high during the initial pause period.
Once all banks have been precharged, the Mode Register Set Command must be issued to initialize
the Mode Register. An additional eight Auto Refresh cycles (CBR) are also required before or after
programming the Mode Register to ensure proper subsequent operation.
7.2 Programming Mode Register
After initial power up, the Mode Register Set Command must be issued for proper device operation.
All banks must be in a precharged state and CKE must be high at least one cycle before the Mode
Register Set Command can be issued. The Mode Register Set Command is activated by the low
signals of RAS , CAS , CS and WE at the positive edge of the clock. The address input data
during this cycle defines the parameters to be set as shown in the Mode Register Operation table. A
new command may be issued following the mode register set command once a delay equal to tRSC
has elapsed. Please refer to the next page for Mode Register Set Cycle and Operation Table.
7.3 Bank Activate Command
The Bank Activate command must be applied before any Read or Write operation can be executed.
The operation is similar to RAS activate in EDO DRAM. The delay from when the Bank Activate
command is applied to when the first read or write operation can begin must not be less than the RAS
to CAS delay time (tRCD). Once a bank has been activated it must be precharged before another Bank
Activate command can be issued to the same bank. The minimum time interval between successive
Bank Activate commands to the same bank is determined by the RAS cycle time of the device (tRC).
The minimum time interval between interleaved Bank Activate commands (Bank A to Bank B and vice
versa) is the Bank to Bank delay time (tRRD). The maximum time that each bank can be held active is
specified as tRAS (max).
7.4 Read and Write Access Modes
After a bank has been activated, a read or write cycle can be followed. This is accomplished by setting
RAS
high and CAS low at the clock rising edge after minimum of tRCD delay. WE pin voltage level
defines whether the access cycle is a read operation ( WE high), or a write operation ( WE low). The
address inputs determine the starting column address.
Reading or writing to a different row within an activated bank requires the bank be precharged and a
new Bank Activate command be issued. When more than one bank is activated, interleaved bank
Read or Write operations are possible. By using the programmed burst length and alternating the
access and precharge operations between multiple banks, seamless data access operation among
many different pages can be realized. Read or Write Commands can also be issued to the same bank
or between active banks on every clock cycle.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W9812G6JH-6I 功能描述:IC SDRAM 128MBIT 54TSOPII RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:閃存 - NAND 存儲(chǔ)容量:4G（256M x 16） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:0°C ~ 70°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP I 包裝:Digi-Reel® 其它名稱(chēng):557-1461-6
W9812G6JH-75 制造商:Winbond Electronics Corp 功能描述:8*16 SDRAM
W981616AH 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:512K x 2 BANKS x 16 BIT SDRAM
W981616AH-6 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:x16 SDRAM
W981616AH-7 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:x16 SDRAM
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