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參數(shù)資料
| 型號(hào)： | W971GG6IB-25 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | DRAM |
| 英文描述： | 32M X 16 DDR DRAM, 0.4 ns, PBGA84 |
| 封裝： | 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 |
| 文件頁數(shù)： | 22/86頁 |
| 文件大?。?/td> | 1360K |
| 代理商： | W971GG6IB-25 |
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W971GG6IB
Publication Release Date: Oct. 23, 2009
- 29 -
Revision A02
Table 5—Precharge & Auto-precharge clarifications
From
Command
To Command
Minimum Delay between “From
Command” to “To Command”
Unit
Notes
Precharge (to same Bank as Read)
AL + BL/2 + max(RTP, 2) - 2
clks
1, 2
Read
Precharge All
AL + BL/2 + max(RTP, 2) - 2
clks
1, 2
Precharge (to same Bank as Read w/AP)
AL + BL/2 + max(RTP, 2) - 2
clks
1, 2
Read w/AP
Precharge All
AL + BL/2 + max(RTP, 2) - 2
clks
1, 2
Precharge (to same Bank as Write)
WL + BL/2 + tWR
clks
2
Write
Precharge All
WL + BL/2 + tWR
clks
2
Precharge (to same Bank as Write w/AP)
WL + BL/2 + WR
clks
2
Write w/AP
Precharge All
WL + BL/2 + WR
clks
2
Precharge (to same Bank as Precharge)
1
clks
2
Precharge
Precharge All
1
clks
2
Precharge
1
clks
2
Precharge
All
Precharge All
1
clks
2
Notes:
1. RTP[cycles] = RU{ tRTP[nS] / tCK(avg)[nS] }, where RU stands for round up.
2. For a given bank, the precharge period should be counted from the latest precharge command, either one bank precharge or
precharge all, issued to that bank. The precharge period is satisfied after tRP or tRPall (= tRP + 1 x tCK) depending on the
latest precharge command issued to that bank.
7.8 Refresh Operation
DDR2 SDRAM requires a refresh of all rows in any rolling 64 ms interval. The necessary refresh can
be generated in one of two ways: by explicit Auto Refresh commands or by an internally timed Self
Refresh mode.
Self Refresh mode enters issuing the Self Refresh command (CKE asserted "LOW") while all banks
are in the idle state. The device is in Self Refresh mode for as long as CKE held "LOW". In the case of
8192 burst Auto Refresh commands, 8192 burst Auto Refresh commands must be performed within
7.8 S before entering and after exiting the Self Refresh mode. In the case of distributed Auto Refresh
commands, distributed auto refresh commands must be issued every 7.8 S and the last distributed
Auto Refresh commands must be performed within 7.8 S before entering the self refresh mode. After
exiting from the Self Refresh mode, the refresh operation must be performed within 7.8 S. In Self
Refresh mode, all input/output buffers are disable, resulting in lower power dissipation (except CKE
buffer). (Example timing waveform refer to 10.29 Self Refresh diagram in Chapter 10)
7.9 Power Down Mode
Power-down is synchronously entered when CKE is registered LOW, along with NOP or Deselect
command. CKE is not allowed to go LOW while mode register or extended mode register command
time, or read or write operation is in progress. CKE is allowed to go LOW while any other operation
such as row activation, Precharge or Auto-precharge or Auto Refresh is in progress, but power down
IDD specification will not be applied until finishing those operations.
The DLL should be in a locked state when power-down is entered. Otherwise DLL should be reset
after exiting power-down mode for proper read operation.
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| W9751G6JB-25A | 32M X 16 DDR DRAM, 0.4 ns, PBGA84 |
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| W9812G21H-6I | 4M X 32 SYNCHRONOUS DRAM, 5 ns, PDSO86 |
| W9812G21H-6C | 4M X 32 SYNCHRONOUS DRAM, 4.5 ns, PDSO86 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W971GG6JB | 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M ? 8 BANKS ? 16 BIT DDR2 SDRAM |
| W971GG6JB-18 | 制造商:Winbond Electronics Corp 功能描述:1GB DDR2 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 1GBIT 1.875NS |
| W971GG6JB-25 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics 功能描述:64MBX16 DDR2 制造商:Winbond 功能描述:DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin WBGA |
| W971GG6JB25I | 功能描述:IC DDR2 SDRAM 1GBIT 84WBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:32K (4K x 8) 速度:100kHz，400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) 其它名稱:CAV24C32WE-GT3OSTR |
| W971GG6JB-25I | 制造商:Winbond Electronics 功能描述:-40~85 1GB DDR2 FOR INDUSTRY |
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