參數(shù)資料
型號: W3E32M64S-200SBI
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: DRAM
英文描述: 32M X 64 DDR DRAM, 0.8 ns, PBGA208
封裝: 13 X 22 MM, PLASTIC, BGA-208
文件頁數(shù): 8/18頁
文件大小: 648K
代理商: W3E32M64S-200SBI
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E32M64S-XSBX
January 2008
Rev. 6
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 64
2.5V Power Supply
DATA RATE (Mbs)
200 = 200Mbs
250 = 250Mbs
266 = 266Mbs
333 = 333Mbs
PACKAGE:
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 32M 64 S - XXX SB X
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3E32M64S-200SBM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk
W3E32M64S-250BC 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M64S-250BI 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W3E32M64S-250BM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk
W3E32M64S-250SBC 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk