參數(shù)資料
型號: W3E32M64S-200SBI
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: DRAM
英文描述: 32M X 64 DDR DRAM, 0.8 ns, PBGA208
封裝: 13 X 22 MM, PLASTIC, BGA-208
文件頁數(shù): 17/18頁
文件大?。?/td> 648K
代理商: W3E32M64S-200SBI
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E32M64S-XSBX
January 2008
Rev. 6
COMMAND
READ
NOP
CL = 2.5
DON'T CARE
TRANSITIONING DATA
DQ
DQS
T0
T1
T2
T2n
T3
T3n
COMMAND
READ
NOP
CL = 2
DQ
DQS
CLK
T0
T1
T2
T2n
T3
T3n
Burst Length = 4 in the cases shown
Shown with nominal tAC and nominal tDSDQ
DATA
CLK
FIGURE 4 – CAS LATENCY
FIGURE 5 – EXTENDED MODE REGISTER
DEFINITION
DLL
Enable
Disable
DLL
NA
A9
A7 A6 A5 A4 A3
A8
A2 A1 A0
Extended Mode
Register (Ex)
Address Bus
Operating Mode
A10
A11
11
01
BA0
BA1
E0
0
1
Operating Mode
Reserved
E1, E0
Valid
-
E12
0
-
E10
0
-
E9
0
-
E8
0
-
E7
0
-
E6
0
-
E5
0
-
E4
0
-
E3
0
-
A12
E11
0
-
1. E14 and E13 must be "0, 1" to select the Extended Mode Register (vs. the base Mode Register)
2. The QFC# function is not supported.
E2
0
-
in conjunction with a specific READ or WRITE command.
A precharge of the bank/row that is addressed with the
READ or WRITE command is automatically performed
upon completion of the READ or WRITE burst. AUTO
PRECHARGE is nonpersistent in that it is either enabled
or disabled for each individual READ or WRITE command.
The device supports concurrent auto precharge if the
command to the other bank does not interrupt the data
transfer to the current bank.
AUTO PRECHARGE ensures that the precharge is
initiated at the earliest valid stage within a burst. This
“earliest valid stage” is determined as if an explicit
precharge command was issued at the earliest possible
time, without violating tRAS (MIN).The user must not issue
another command to the same bank until the precharge
time (tRP) is completed.
BURST TERMINATE
The BURST TERMINATE command is used to truncate
READ bursts (with auto precharge disabled). The most
recently registered READ command prior to the BURST
TERMINATE command will be truncated. The open page
which the READ burst was terminated from remains
open.
AUTO REFRESH
AUTO REFRESH is used during normal operation of the
DDR SDRAM and is analogous to CAS-BEFORE-RAS
(CBR) REFRESH in conventional DRAMs. This command
is nonpersistent, so it must be issued each time a refresh
is required.
The addressing is generated by the internal refresh
controller. This makes the address bits “Don’t Care” during
an AUTO REFRESH command. Each DDR SDRAM
requires AUTO REFRESH cycles at an average interval
of 7.8125μs (maximum).
To allow for improved efficiency in scheduling and
switching between tasks, some flexibility in the absolute
refresh interval is provided. A maximum of eight AUTO
REFRESH commands can be posted to any given DDR
SDRAM, meaning that the maximum absolute interval
between any AUTO REFRESH command and the next
AUTO REFRESH command is 9 x 7.8125μs (70.3μs). This
maximum absolute interval is to allow future support for
DLL updates internal to the DDR SDRAM to be restricted
to AUTO REFRESH cycles, without allowing excessive
drift in tAC between updates.
相關(guān)PDF資料
PDF描述
W3EG6433S262BD4 32M X 64 DDR DRAM MODULE, 0.75 ns, DMA200
WS57C256F-35C 32K X 8 UVPROM, 35 ns, CQCC32
WF128K32A-120HSI 512K X 8 FLASH 12V PROM MODULE, 120 ns, CHIP66
WF512K32-90HI5 512K X 32 FLASH 5V PROM MODULE, 90 ns, CHIP66
WMF2M8-90OPM5 2M X 8 FLASH 5V PROM, 90 ns, CDSO56
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3E32M64S-200SBM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk
W3E32M64S-250BC 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M64S-250BI 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W3E32M64S-250BM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk
W3E32M64S-250SBC 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk