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參數(shù)資料
| 型號(hào)： | STPCE1HDC |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 78/87頁 |
| 文件大?。?/td> | 1356K |
| 代理商： | STPCE1HDC |
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DESIGN GUIDELINES
78/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Release 1.3 - January 29, 2002
When considering thermal dissipation, one of the
most important parts of the layout is the
connection between the ground balls and the
ground layer.
A 1-wire connection is shown in
Figure 6-25
. The
use of a 8-mil wire results in a thermal resistance
of 105°C/W assuming copper is used (418 W/
m.°K). This high value is due to the thickness (34
μm) of the copper on the external side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9°C/W. This can be easily
improved using four 12.5 mil wires to connect to
the four vias around the ground pad link as in
Figure 6-26
. This gives a total of 49 vias and a
global resistance for the 36 thermal balls of 0.5°C/
W.
The use of a ground plane like in
Figure 6-27
is
even better.
Figure 6-25. Recommended 1-wire Power/Ground Pad Layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 12.5 mil)
Via (diameter = 24 mil)
345ml
1 mil = 0.0254 mm
Figure 6-26. Recommended 4-wire Ground Pad Layout
4 via pads for each ground ball
相關(guān)PDF資料 |
PDF描述 |
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| STPCELITE | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EDBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HEBC | X86 Core General Purpose PC Compatible System - on - Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCE1HEBC | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCE1HEBI | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCELITE | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCH0.5MBBL | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
| STPCH0.5MBBU | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
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