參數資料
型號: STPCE1HDC
英文描述: Microprocessor
中文描述: 微處理器
文件頁數: 56/87頁
文件大?。?/td> 1356K
代理商: STPCE1HDC
MECHANICAL DATA
56/87
Release 1.3 - January 29, 2002
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
The structure in shown in
Figure 5-4
.
Thermal dissipation options are illustrated in
Figure 5-5
and
Figure 5-6
.
Figure 5-4. 388-Pin PBGA structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal Dissipation Without Heatsink
Ambient
Board
Case
Junction
Board
Ambient
Ambient
Case
125
Junction
Board
Rca
Rjc
Rjb
Rba
6
6
8.5
Rja = 13 °C/W
Airflow = 0
Board temperature taken at the centrecentre ba
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17μm for internal layers
- 34μm for external layers
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相關代理商/技術參數
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