參數(shù)資料
型號(hào): STPCE1HDC
英文描述: Microprocessor
中文描述: 微處理器
文件頁(yè)數(shù): 57/87頁(yè)
文件大?。?/td> 1356K
代理商: STPCE1HDC
MECHANICAL DATA
Release 1.3 - January 29, 2002
57/87
Figure 5-6. Thermal Dissipation With Heatsink
Board
Ambient
Case
Junction
Board
Ambient
Ambient
Case
50
Junction
Board
Rca
Rjc
Rjb
Rba
3
6
8.5
Rja = 9.5 °C/W
Airflow = 0
Board temperature taken at the centre balls
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17μm for internal layers
- 34μm for external layers
Heat sink is 11.1°C/W
相關(guān)PDF資料
PDF描述
STPCELITE X86 Core General Purpose PC Compatible System - on - Chip
STPCE1EDBI X86 Core General Purpose PC Compatible System - on - Chip
STPCE1EEBC X86 Core General Purpose PC Compatible System - on - Chip
STPCE1EEBI X86 Core General Purpose PC Compatible System - on - Chip
STPCE1HEBC X86 Core General Purpose PC Compatible System - on - Chip
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