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參數(shù)資料
| 型號： | STPCE1HDC |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 77/87頁 |
| 文件大?。?/td> | 1356K |
| 代理商： | STPCE1HDC |
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DESIGN GUIDELINES
Release 1.3 - January 29, 2002
77/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
6.4.4. THERMAL DISSIPATION
6.4.4.1. Power saving
Thermal dissipation of the STPC depends mainly
on supply voltage. When the system does not
need to work at the upper voltage limit, it may
therefore be beneficial to reduce the voltage to the
lower voltage limit, where possible. This could
save a few 100’s of mW.
The second area to look at is unused interfaces
and functions. Depending on the application,
some input signals can be grounded, and some
blocks not powered or shutdown. Clock speed
dynamic adjustment is also a solution that can be
used
along
with
the
management unit.
integrated
power
6.4.4.2. Thermal balls
The standard way to route thermal balls to ground
layer implements only one via pad for each ball
pad, connected using a 8-mil wire.
With such configuration the Plastic BGA package
does 90% of the thermal dissipation through the
ground balls, and especially the central thermal
balls which are directly connected to the die. The
remaining 10% is dissipated through the case.
Adding a heat sink reduces this value to 85%.
As a result, some basic rules must be followed
when routing the STPC in order to avoid thermal
problems.
As the whole ground layer acts as a heat sink, the
ground balls must be directly connected to it, as
illustrated in
Figure 6-24
. If one ground layer is not
enough, a second ground plane may be added.
When possible, it is important to avoid other
devices on-board using the PCB for heat
dissipation, like linear regulators, as this would
heat the STPC itself and reduce the temperature
range of the whole system, In case these devices
can not use a separate heat sink, they must not be
located just near the STPC
Figure 6-24. Ground routing
Pad for ground ball
Thru hole to ground layer
Top Layer : Signals
Power layer
Internal layer: signals
Bottom Layer : ground layer
Note: For better visibility, ground balls are not all routed.
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PDF描述 |
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| STPCELITE | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EDBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HEBC | X86 Core General Purpose PC Compatible System - on - Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCE1HEBC | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCE1HEBI | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCELITE | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCH0.5MBBL | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
| STPCH0.5MBBU | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
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