- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄381118 > STPCE1EDBI (意法半導(dǎo)體) X86 Core General Purpose PC Compatible System - on - Chip PDF資料下載
參數(shù)資料
| 型號： | STPCE1EDBI |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | X86 Core General Purpose PC Compatible System - on - Chip |
| 中文描述： | x86內(nèi)核兼容的通用計算機(jī)系統(tǒng)-關(guān)于-芯片 |
| 文件頁數(shù)： | 78/87頁 |
| 文件大?。?/td> | 1356K |
| 代理商： | STPCE1EDBI |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁當(dāng)前第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁
DESIGN GUIDELINES
78/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Release 1.3 - January 29, 2002
When considering thermal dissipation, one of the
most important parts of the layout is the
connection between the ground balls and the
ground layer.
A 1-wire connection is shown in
Figure 6-25
. The
use of a 8-mil wire results in a thermal resistance
of 105°C/W assuming copper is used (418 W/
m.°K). This high value is due to the thickness (34
μm) of the copper on the external side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9°C/W. This can be easily
improved using four 12.5 mil wires to connect to
the four vias around the ground pad link as in
Figure 6-26
. This gives a total of 49 vias and a
global resistance for the 36 thermal balls of 0.5°C/
W.
The use of a ground plane like in
Figure 6-27
is
even better.
Figure 6-25. Recommended 1-wire Power/Ground Pad Layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 12.5 mil)
Via (diameter = 24 mil)
345ml
1 mil = 0.0254 mm
Figure 6-26. Recommended 4-wire Ground Pad Layout
4 via pads for each ground ball
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| STPCE1EEBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EEBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HEBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HEBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | X86 Core General Purpose PC Compatible System - on - Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCE1EEBC | 制造商:STMicroelectronics 功能描述:X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP - Bulk |
| STPCE1EEBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | 制造商:STMicroelectronics 功能描述:X86 GENERAL PURPOSE CONTROLLER - Bulk |
| STPCE1HDBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。