參數(shù)資料
型號: STPCC0166BTI3
廠商: STMICROELECTRONICS
元件分類: 外設(shè)及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA388
封裝: PLASTIC, BGA-388
文件頁數(shù): 62/71頁
文件大?。?/td> 1238K
代理商: STPCC0166BTI3
Obsolete
Product(s)
- Obsolete
Product(s)
DESIGN GUIDELINES
Issue 2.4 - November 8, 2001
65/71
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to max-
imize the board surface dissipating the heat. The
only limitation is the risk of losing routing chan-
nels. Figure 6-13 and Figure 6-14 show a partial
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
Figure 6-13. Layout for Good Thermal Dissipation - top layer
1
A
Not connectedball
Via
STPC ball
GND ball
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