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| 型號(hào)： | STPCC0166BTI3 |
| 廠商： | STMICROELECTRONICS |
| 元件分類(lèi)： | 外設(shè)及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA388 |
| 封裝： | PLASTIC, BGA-388 |
| 文件頁(yè)數(shù)： | 61/71頁(yè) |
| 文件大小： | 1238K |
| 代理商： | STPCC0166BTI3 |
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DESIGN GUIDELINES
64/71
Issue 2.4 - November 8, 2001
To avoid solder wicking over to the via pads during
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad). This gives a di-
ameter of 33 mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no lo-
cal board distortion is tolerated.
6.3.2.3 Heat dissipation
The thickness of the copper on PCB layers is typ-
ically 34 m for external layers and 17 m for inter-
nal layers. This means that thermal dissipation is
not good; high board temperatures are concen-
trated around the devices and these fall quickly
with increased distance.
Where possible, place a metal layer inside the
PCB; this improves dramatically the spread of
heat and hence the thermal dissipation of the
board.
The possibility of using the whole system box for
thermal dissipation is very useful in cases of high
internal temperatures and low outside tempera-
tures. Bottom side of the PBGA should be ther-
mally connected to the metal chassis in order to
propagate the heat flow through the metal. Ther-
mally connecting also the top side will improve fur-
thermore the heat dissipation. Figure 6-12 illus-
trates such an implementation.
Figure 6-11. Optimum Layout for Central Ground Ball - top layer
Via to Ground layer
Pad for ground ball
Clearance = 6mil
diameter = 25 mil
hole diameter = 14 mil
Solder mask
diameter = 33 mil
External diameter = 37 mil
connections = 10 mil
Figure 6-12. Use of Metal Plate for Thermal Dissipation
Metal planes
Thermal conductor
Board
Die
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