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參數(shù)資料
| 型號(hào)： | STPCC0166BTI3 |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA388 |
| 封裝： | PLASTIC, BGA-388 |
| 文件頁數(shù)： | 59/71頁 |
| 文件大小： | 1238K |
| 代理商： | STPCC0166BTI3 |
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DESIGN GUIDELINES
62/71
Issue 2.4 - November 8, 2001
6.3.2 Thermal dissipation
6.3.2.1 Power saving
Thermal dissipation of the STPC depends mainly
on supply voltage. When the system does not
need to work at the upper voltage limit, it may
therefore be beneficial to reduce the voltage to the
lower voltage limit, where possible. This could
save a few 100’s of mW.
The second area to look at is unused interfaces
and functions. Depending on the application,
some input signals can be grounded, and some
blocks not powered or shutdown. Clock speed dy-
namic adjustment is also a solution that can be
used along with the integrated power manage-
ment unit.
6.3.2.2 Thermal balls
The standard way to route thermal balls to ground
layer implements only one via pad for each ball
pad, connected using a 8-mil wire.
With such configuration the Plastic BGA package
does 90% of the thermal dissipation through the
ground balls, and especially the central thermal
balls which are directly connected to the die. The
remaining 10% is dissipated through the case.
Adding a heat sink reduces this value to 85%.
As a result, some basic rules must be followed
when routing the STPC in order to avoid thermal
problems.
As the whole ground layer acts as a heat sink, the
ground balls must be directly connected to it, as il-
lustrated in Figure 6-8. If one ground layer is not
enough, a second ground plane may be added.
Figure 6-8. Ground routing
Pad for ground ball
Thru hole to ground layer
Top
Lay
er :
Sig
nals
Pow
er la
yer
Inte
rnal
laye
r: sig
nals
Bott
om
Lay
er :
gro
und
laye
r
Note: For better visibility, ground balls are not all routed.
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