參數(shù)資料
型號(hào): STP2200ABGA-100
元件分類: 存儲(chǔ)控制器/管理單元
英文描述: 256M X 8, DRAM CONTROLLER, PBGA225
封裝: PLASTIC, BGA-225
文件頁數(shù): 29/36頁
文件大小: 433K
代理商: STP2200ABGA-100
35
Uniprocessor System Controller
USC
STP2200ABGA
July 1997
225-Pin Plastic ABGA Package Dimensions
Notes:
1. Drawing is not to scale.
2. Unless otherwise specied, all dimensions are in millimeters. Nonlimited
dimensions other than size of raw material shall be held as follows when
expressed:
10-2 decimal places,
± 0.13 as angles,
10-3 decimal places
3. It is imperative that measures be taken during assembly, handling, etc. to
prevent the possibility of damage to devices by static electric discharge.
4. The atness of the overmold surface in the center 10.16 mm DIA area, shall
be within 0.076 mm.
Position A1
Indicator
0.78 DIA
Approx.
(Gold plated)
12.00 ± 0.10
TYP
13.50 ± 0.10
TYP
0.35
C
1.73 ± 0.10
0.56 ± 0.06
0.60 ± 0.05
TYP
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
3.00
TYP
R
25° Approx.
0.15
C
Solder ball grid
array coordinates
are for reference only
PN
M
L
K
J
HG
F
E
D
C
B
A
3.00
TYP
Seating
Plane
14
Spaces
@
1.50
=
21.00
14 Spaces @ 1.50 = 21.00
-C-
24.00 ± 0.10
Square
27.00 ± 0.10
Square
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