參數(shù)資料
型號： SJA1000
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： Stand-alone CAN controller(單機CAN控制器)
中文描述： 2 CHANNEL(S), 1M bps, LOCAL AREA NETWORK CONTROLLER, PDIP28
封裝： 0.600 INCH, PLASTIC, DIP-28
文件頁數(shù)： 65/68頁
文件大?。?/td> 234K
代理商： SJA1000
2000 Jan 04
65
Philips Semiconductors
Product specification
Stand-alone CAN controller
SJA1000
12 SOLDERING
12.1
Introduction
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
12.2
Through-hole mount packages
12.2.1
S
OLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
12.2.2
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
12.3
Surface mount packages
12.3.1
R
EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
°
C. The top-surface temperature of the
packages should preferable be kept below 230
°
C.
12.3.2
W
AVE SOLDERING
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
12.3.3
M
ANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°
C.
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SJA1000/N1,112 功能描述:網(wǎng)絡(luò)控制器與處理器 IC STAND-ALONE CAN CONTROLLER RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
SJA1000/N1112 制造商:NXP Semiconductors 功能描述:IC CAN CONTROLLER 1000 DIP28
SJA1000N 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Stand-alone CAN controller
SJA1000T 制造商:NXP Semiconductors 功能描述:
SJA1000T/N,112 功能描述:網(wǎng)絡(luò)控制器與處理器 IC STAND ALONE CAN CONTROLLER RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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