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參數(shù)資料
| 型號： | PE3337-99 |
| 廠商： | PEREGRINE SEMICONDUCTOR CORP |
| 元件分類： | PLL合成/DDS/VCOs |
| 英文描述： | PHASE LOCKED LOOP, UUC52 |
| 封裝： | WAFER-52 |
| 文件頁數(shù)： | 4/13頁 |
| 文件大小： | 315K |
| 代理商： | PE3337-99 |
PE3337
Advance Information
Copyright
Peregrine Semiconductor Corp. 2003
File No. 70/0150~00A
| | UTSi CMOS RFIC SOLUTIONS
Page 12 of 13
Recommended Dice Assembly Procedure
Cleaning
Dice supplied in die or wafer form do not require
cleaning prior to assembly.
Die Attach
The Peregrine Semiconductor die substrate is
sapphire and the recommended die attach
operation uses epoxy die attach adhesive. The
eutectic die attach method does not work with
sapphire substrates.
Bonding
Thermocompression gold ball or aluminum
ultrasonic bonding may be used. The gold ball
should be about three times the diameter of the
gold wire. The ball should cover the bonding pad,
but not excessively, or it may short out surrounding
metallization. Aluminum 1-mil wire may be used on
most dice, but should not be used if the assembled
unit will be plastic encapsulated. Note the bonding
pad material is aluminum.
Shipping Method
Standard die carrier packages and wafer packages
are vacuum-sealed with dessicant inside an ESD
shielding moisture barrier bag. Sealed product is
then placed inside corrugated cardboard box
surrounded by bubble wrap or foam for maximum
protection during shipment.
Table 6. Ordering Information
Order Code Part Marking
Description
Package
Shipping
Method
PE3337-99
D3337
PE3337-DIE-100W
Waffle Pack
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