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參數(shù)資料
| 型號： | PE3337-99 |
| 廠商： | PEREGRINE SEMICONDUCTOR CORP |
| 元件分類： | PLL合成/DDS/VCOs |
| 英文描述： | PHASE LOCKED LOOP, UUC52 |
| 封裝： | WAFER-52 |
| 文件頁數(shù)： | 3/13頁 |
| 文件大?。?/td> | 315K |
| 代理商： | PE3337-99 |
PE3337
Advance Information
PEREGRINE SEMICONDUCTOR CORP. | http://www.peregrine-semi.com
Copyright
Peregrine Semiconductor Corp. 2003
Page 11 of 13
Figure 13. Dice and Wafer Processing Flow
QC Elect.
Inspection
Pack & Ship
Dice
Wafer
Processing
Visual
Inspection
Process Control
Monitor (PCM)
Wafer Level
Reliability (WLR)
100%
Elect. Probe
Backgrind
and Polish
Wafer
Dicing
QC Visual
Inspection
Wafers
100% Visual
Separate Rejects
Die
Picking
Dice
Wafers
Dice
Pack & Ship
Wafers
Carrier
Loading
Wafer Package
visually inspected and diced.
Figure 14. Wafer Mount
Wafer Mount/Dicing
In preparation for dicing, wafers are mounted to film
frames or rings with mounting tape. There are two
types of tape that can be utilized: PVC backed or
U.V. release tape. Figure 14 shows a wafer
mounted on film frame using PVC backed mounting
tape.
100% electrically probed – rejects inked.
Preferred for production quantities.
Lowest cost.
Wafer is supplied, thinned and diced.
Wafer and Die Package, Storage and
Preservation
Proper storage conditions are necessary to prevent
product contamination and/or degradation after
shipment.
Product should be stored in original
unopened packaging or, once opened, in a
Nitrogen purged cabinet at room
temperature (45% +/- 15% RH controlled
environment).
Sawn wafers mounted on dicing tape are
intended for immediate use and have a
limited shelf life. This is primarily due to the
nature of the adhesive tape used for
mounting the product. This product can be
stored for up to 30 days. This applies
whether or not the material has remained in
its original sealed container. To reduce the
risk of contamination or degradation, it is
recommended that product not being used
in the assembly process be returned to their
original containers and resealed with a
vacuum seal process.
In all cases, the customer must determine
the applicability of extended storage
durations and conditions with respect to their
assembly process and end product criteria.
Die Handling
All die products must be handled only at ESD safe
workstations. Standard ESD precautions and safe
work environments are as defined in MIL-HDBK-
263. ESD wrist strap and cord must be worn at a
static safe workstation to eliminate failures due to
ESD. Product must be handled only in a class
10,000 or better designated clean room
environment.
Singulated die are not to be handled with tweezers.
A vacuum wand with a non-metallic ESD protected
tip should be used. Automated Wafer and Die
Handling systems are readily available and provide
the highest degree of protection and consistency to
the handling operation.
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