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參數(shù)資料
| 型號(hào)： | PE3337-99 |
| 廠商： | PEREGRINE SEMICONDUCTOR CORP |
| 元件分類： | PLL合成/DDS/VCOs |
| 英文描述： | PHASE LOCKED LOOP, UUC52 |
| 封裝： | WAFER-52 |
| 文件頁數(shù)： | 2/13頁 |
| 文件大?。?/td> | 315K |
| 代理商： | PE3337-99 |
PE3337
Advance Information
Copyright
Peregrine Semiconductor Corp. 2003
File No. 70/0150~00A
| | UTSi CMOS RFIC SOLUTIONS
Page 10 of 13
Phase Detector Outputs
The phase detector is triggered by rising edges
from the main counter (fp) and the reference counter
(fc). It has two outputs, PD_U, and PD_D. If the
divided VCO leads the divided reference in phase
or frequency (fp leads fc), PD_D pulses “l(fā)ow”. If the
divided reference leads the divided VCO in phase
or frequency (fc leads fp), PD_U pulses “l(fā)ow”. The
width of either pulse is directly proportional to phase
offset between the two input signals, fp and fc. The
phase detector gain is 430 mV / radian.
PD_U and PD_D are designed to drive an active
loop filter which controls the VCO tune voltage.
PD_U pulses result in an increase in VCO
frequency and PD_D results in a decrease in VCO
frequency.
Software tools for designing the active loop filter
can be found at Peregrine’s web site
(www.peregrine-semi.com).
Lock Detect Output
A lock detect signal is provided at pin LD, via the
pin CEXT (see Figure 1). CEXT is the logical “NAND”
of PD_U and PD_D waveforms, driven through a
series 2k ohm resistor. Connecting CEXT to an
external shunt capacitor provides integration of this
signal.
The CEXT signal is then sent to the LD pin through
an internal inverting comparator with an open drain
output. Thus LD is an “AND” function of PD_U and
PD_D.
Wafer and Die Packaging Options
Peregrine Semiconductor has two methods for
shipment of die to our customers. The shipping
option used is based on the customer’s
requirements and the number of die being shipped.
Peregrine offers product dice in two packaging
options: Standard Die Carrier Packages and Wafer
Packages. Where no shipping method is specified,
Peregrine will sip in Standard Die Carrier Package
(waffle pack).
Standard Die Carrier Package
Chips which have been electrically probed,
inked, visually inspected, diced, may be
packaged in 4”x4” Waffle Packs.
Standard die carrier packages protect the
product from mechanical damage during
shipment and prevent individual die from
contacting one another
The containers also provide protection from
static discharge, moisture and other
contamination by sealing in the proper static
and moisture protective bags.
Die are held in cavities with defined matrix.
Ideal for small volumes.
Die orientation is indicated on label.
100% electrically probed dice with electrical
rejects removed.
100% visually sorted with mechanical and
visual rejects removed.
Easy visual inspection – dice in carriers,
geometry side up.
Carrier holds 100 dice.
Figure 12. Waffle Pack
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