參數(shù)資料
型號： MT47H64M8CF-5EAT:F
元件分類： DRAM
英文描述： DDR DRAM, PBGA60
封裝： 8 X 10 MM, ROHS COMPLIANT, FBGA-60
文件頁數(shù)： 1/139頁
文件大?。?/td> 9398K
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1 tCK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8,192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS compliant
Supports JEDEC clock jitter specification
Options1
Marking
Configuration
– 256 Meg x 4 (32 Meg x 4 x 4 banks)
128M4
– 128 Meg x 8 (16 Meg x 8 x 4 banks)
64M8
– 64 Meg x 16 (8 Meg x 16 x 4 banks)
32M16
FBGA package (Pb-free) – x16
– 84-ball FBGA (12mm x 12.5mm) Rev. B
CC
– 84-ball FBGA (10mm x 12.5mm) Rev. D
BN
– 84-ball FBGA (8mm x 12.5mm) Rev. F
HR
FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (12mm x 10mm) Rev. B
CB
– 60-ball FBGA (10mm x 10mm) Rev. D
B6
– 60-ball FBGA (8mm x 10mm) Rev. F
CF
FBGA package (lead solder) – x16
– 84-ball FBGA (12mm x 12.5mm) Rev. B
GC
– 84-ball FBGA (10mm x 12.5mm) Rev. D
FN
– 84-ball FBGA (8mm x 12.5mm) Rev. F
HW
FBGA package (lead solder) – x4, x8
– 60-ball FBGA (12mm x 10mm) Rev. B
GB
– 60-ball FBGA (10mm x 10mm) Rev. D
F6
– 60-ball FBGA (8mm x 10mm) Rev. F
JN
Timing – cycle time
– 2.5ns @ CL = 5 (DDR2-800)
-25E
– 2.5ns @ CL = 6 (DDR2-800)
-25
– 3.0ns @ CL = 4 (DDR2-667)
-3E
– 3.0ns @ CL = 5 (DDR2-667)
-3
– 3.75ns @ CL = 4 (DDR2-533)
-37E
– 5.0ns @ CL = 3 (DDR2-400)
-5E
Self refresh
– Standard
None
– Low-power
L
Operating temperature
– Commercial (0°C ≤ TC ≤ 85°C)
None
– Industrial (–40°C ≤ TC ≤ 95°C;
–40°C
≤ TA ≤ 85°C)
IT
– Automotive, Revision :D only
(–40°C
≤ TC, TA ≤ 105°C)
AT
Revision
:B/:D/:F
Note: 1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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