參數(shù)資料
型號(hào)： MSC8101M1250C
廠商： MOTOROLA INC
元件分類： 數(shù)字信號(hào)處理
英文描述： Network Digital Signal Processor
中文描述： 64-BIT, 62.5 MHz, OTHER DSP, PBGA332
封裝： 17 X 17 MM, LIDDED FLIP CHIP, PLASTIC, BGA-332
文件頁數(shù)： 42/104頁
文件大?。?/td> 877K
代理商： MSC8101M1250C
MSC8101 Technical Data, Rev. 16
2-2
Freescale Semiconductor
Physical and Electrical Specifications
2.2 Recommended Operating Conditions
Table 2-2
lists recommended operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2.3 Thermal Characteristics
Table 2-3
describes thermal characteristics of the MSC8101.
See
Section 4.1
,
Thermal Design Considerations
, on page 4-1 for details on these characteristics.
Table 2-2.
Recommended Operating Conditions
Rating
Symbol
Value
Unit
SC140 core supply voltage
V
DD
250/275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
V
V
PLL supply voltage
V
CCSYN
250/275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
V
V
I/O supply voltage
V
DDH
V
IN
T
J
3.135 to 3.465
V
Input voltage
–0.2 to V
DDH
+ 0.2
250/275 MHz: –40 to 105
300 MHz: –40 to 75
V
Operating temperature range
°C
°C
Table 2-3.
Thermal Characteristics
Characteristic
Symbol
Lidded FC-PBGA
17
×
17 mm
Unit
Natural Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient, single-layer board
1, 2
Junction-to-ambient, four-layer board
1, 3
Junction-to-board
3
Junction-to-case
4
R
θ
JA
or
θ
JA
R
θ
JA
or
θ
JA
R
θ
JB
or
θ
JB
R
θ
JC
or
θ
JC
50
37
°C/W
22
18
°C/W
15
°C/W
TBD
°C/W
Notes:
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface without thermal grease. TBD = to be determined. If a thin (less
than 50 micron) thermal grease interface is established to a heat sink from the lid, the junction to sink thermal resistance is
about 0.7 °C/W.
2.
3.
4.
5.
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