參數(shù)資料
型號(hào)： MPC8245TZU333D
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件頁(yè)數(shù)： 44/60頁(yè)
文件大小： 674K
代理商： MPC8245TZU333D
MOTOROLA
MPC8245 Integrated Processor Hardware Specications
49
System Design Information
may be required to maintain junction temperature within specications. Proper thermal control design is
primarily dependent upon the system-level design: the heat sink, airow, and thermal interface material. To
reduce the die-junction temperature, heat sinks may be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly;
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 28 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package and there exists a high board-level thermal loading
from adjacent components.
A heat sink is not attached to the TBGA package and there exists a low board-level thermal loading
from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package and there exists high
board-level thermal loading from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package and there exists low
board-level thermal loading from adjacent components.
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Adhesive or
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參數(shù)描述
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