參數(shù)資料
型號: MPC8245TZU333D
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
封裝: 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件頁數(shù): 25/60頁
文件大小: 674K
代理商: MPC8245TZU333D
MOTOROLA
MPC8245 Integrated Processor Hardware Specications
31
Package Description
1.5
Package Description
This section details package parameters, pin assignments, and dimensions.
1.5.1
Package Parameters for the MPC8245
The MPC8245 uses a 35 mm
× 35 mm, cavity up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Package Outline
35 mm
× 35 mm
Interconnects
352
Pitch
1.27 mm
Solder Balls
62 Sn/36 Pb/2 Ag
Solder Ball Diameter
0.75 mm
Maximum Module Height
1.65 mm
Co-Planarity Specication
0.15 mm
Maximum Force
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
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MPC8245TVV350D 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352
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