Electrical Specifications
Data Sheet
MC68HC908SR12MC68HC08SR12 — Rev. 5.0
386
Electrical Specifications
Freescale Semiconductor
24.18 FLASH Memory Characteristics
Table 24-17. FLASH Memory Electrical Characteristics
Characteristic
Symbol
Min.
Max.
Unit
Data retention voltage
V
RDR
1.3
—
V
Number of rows per page
2
Rows
Number of bytes per page
128
Bytes
Read bus clock frequency
f
Read(1)
Notes
:
1. f
Read
is defined as the frequency range for which the FLASH memory can be read.
2. If the page erase time is longer than t
Erase
(Min.), there is no erase-disturb, but it reduces the endurance of the FLASH
memory.
3. If the mass erase time is longer than t
MErase
(Min.), there is no erase-disturb, but is reduces the endurance of the FLASH
memory.
4. It is defined as the time it needs before the FLASH can be read after turning off the high voltage charge pump, by clearing
HVEN to logic 0.
5. t
hv
is the cumulative high voltage programming time to the same row before next erase, and the same address can not be
programmed twice before next erase.
6. The minimum row endurance value specifies each row of the FLASH memory is guaranteed to work for at least this many
erase/program cycles.
7. The minimum row endurance value specifies each row of the FLASH memory is guaranteed to work for at least this many
erase/program cycle.
8. The FLASH is guaranteed to retain data over the entire operating temperature range for at least the minimum time
specified.
32k
8M
Hz
Page erase time
t
Erase(2)
1
—
ms
Mass erase time
t
MErase(3)
4
—
ms
PGM/ERASE to HVEN setup time
t
nvs
10
—
μ
s
High-voltage hold time
t
nvh
5
—
μ
s
High-voltage hold time (mass erase)
t
nvhl
100
—
μ
s
Program hold time
t
pgs
5
—
μ
s
Program time
t
Prog
30
40
μ
s
Address/data setup time
t
ads
—
30
ns
Address/data hold time
t
adh
—
30
ns
Recovery time
t
rcv(4)
1
—
μ
s
Cumulative HV period
t
hv(5)
—
25
ms
Row erase endurance
(6)
—
10k
—
Cycles
Row program endurance
(7)
—
10k
—
Cycles
Data retention time
(8)
—
10
—
Years