參數(shù)資料
型號: M5M4V16169DRT-10
廠商: Mitsubishi Electric Corporation
英文描述: 16MCDRAM:16M(1M-WORD BY 16-BIT) CACHED DRAM WITH 16K (1024-WORD BY 16-BIT) SRAM
中文描述: 16MCDRAM:16米(100萬字由16位)與16K的緩存內(nèi)存(1024字由16位)的SRAM
文件頁數(shù): 17/64頁
文件大?。?/td> 737K
代理商: M5M4V16169DRT-10
M5M4V16169DTP/RT-7,-8,-10,-15
16MCDRAM:16M(1M-WORD BY 16-BIT) CACHED DRAM WITH 16K (1024-WORD BY 16-BIT) SRAM
MODE DESCRIPTIONS (10)
MITSUBISHI LSIs
(REV 1.0) Jul. 1998
MITSUBISHI ELECTRIC
Notes:
1)
This function is performed in a Latency period specified in the Access Latency Table.
2)
After the Latency Period (specified in the Access Latency Table) new data will be present
in the Read Buffer2. Prior to the Latency timeout, old data will be present in the RB2.
3)
After data has been transferred from WB1, the entire WB1 Mask is Set.
4)
Valid Ad0-Ad2 addresses are shown in the FUNCTION TRUTH TABLE.
DRAM
Activate
DRAM
Precharge
DRAM
Auto-Refresh
DRAM
Self Refresh
Addresses are latched from the Ad0-Ad11 inputs by the rising edge of K. Internally, a DRAM row is
selected (Page Call) in preparation for a DRAM Read or Write Transfer cycle. A DRAM Precharge
cycle must separate all DRAM Activate cycles.
Internally, the active DRAM Row is deselected (completing the refresh process) and page-mode is
disabled. The DRAM is precharged prior to another DRAM Activate cycle.
Internally, a DRAM row is selected and refreshed (as addressed by an internal, self-incrementing
counter), followed by an internally generated Precharge cycle. The Auto refresh cycle can be
implemented only if the DRAM is in Precharge state (i.e., a Precharge or Auto-Refresh cycle
occurred more recently than an Acitvate cycle). DRAM Auto-Refresh is similar to a CAS-Before-
RAS (CBR) mode in standard DRAMs.
All clock buffers are suspended, and CMd# asynchronously controls Self Refresh (CMd# rising
edge initiates exit from Self Refresh). During Self Refresh, device enters a low power mode, with
2048 automatic refresh cycles.
Set
Command
Register
When SCR is initiated,the addresses present on the Ad0-Ad11 DRAM Address pins determine the
DRAM Read Transfer Latency, the Output Mode (transparent / latched / registered), and WB1
transfer mask mode (set-all/ no change). No DRAM operation is executed in this cycle. Refer to
the SCR Truth Table for legal Address values.
During SCR cycle and the following 3 clock cycles(totally 4 clock cycles), only NOP,DNOP orDPD
are allowed in DRAM portion and only NOP,DES or SPD are done in SRAM portion. The set
commands are valid at least after the above 4 clocks later and the previous function is not
guaranteed to work if it has not been completed.(i.e. DRT ,DWT1&R,DWT2&R and SR,BR and
BRTR with registered output mode.)
17
Power-On sequence
Before starting normal operation, the following power on sequence is necessary.
1) Apply power and maintain stable power (pause) for 500us.
2) Perform a precharge (PCG) operation.
3) After tRP, perform 8 auto refresh commands (ARF) with adequate interval (tRC).
4) Issue set command register (SCR) to initilize the mode register.
After this sequence, the RAM is in idle state and ready for normal operation.
Note that DNOP / DPD and DES / SPD or NOP command will be the stand-by command
for the above power sequence.
Vcc must be powered-on at the same time or before VccQ is on.
And Vcc must be powered-off at the same time or after VccQ is off.
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