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參數(shù)資料
| 型號： | IBM25PPC750L-FB0B333W |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 9/46頁 |
| 文件大小： | 610K |
| 代理商： | IBM25PPC750L-FB0B333W |
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9/30/99
Version 2.0
Datasheet
Page 13
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
60x Bus Output AC Specications
The following table provides the 60x bus output AC timing specifications for the PID8p-750 as defined in
Figure 5. Output timing specification for the L2 bus are provided in the Section “L2 Bus Output AC Specifica-
60X Bus Output AC Timing Specications1
2
Num
Characteristic
300, 333, 350, 366,
375, 400, 433, 450, 466, 500MHz
Unit
Notes
Minimum
Maximum
12
SYSCLK to Output Driven (Output Enable Time)
0.5
ns
8
13
SYSCLK to Output Valid (TS, ABB, ARTRY, DBB, and TBST)
–
4.5
ns
5
14
SYSCLK to all other Output Valid (all except TS, ABB, ARTRY,
DBB, and TBST)
–
5.0
ns
5
15
SYSCLK to Output Invalid (Output Hold)
1.0
ns
3, 8, 9
16
SYSCLK to Output High Impedance (all signals except ABB,
ARTRY, and DBB)
–
6.0
ns
8
17
SYSCLK to ABB and DBB high impedance after precharge
–
1.0
t
SYSCLK
4, 6, 8
18
SYSCLK to ARTRY high impedance before precharge
–
5.5
ns
8
19
SYSCLK to ARTRY precharge enable
0.2
×t
SYSCLK + 1.0
ns
3, 4, 7
20
Maximum delay to ARTRY precharge
1
t
SYSCLK
4, 7
21
SYSCLK to ARTRY high impedance after precharge
2
t
SYSCLK
4, 7, 8
Note:
1. All output specifications are measured from the midpoint voltage of the rising edge of SYSCLK to the midpoint voltage of the signal in question. Both
input and output timings are measured at the pin. Midpoint voltage (VM) is 1.4v for OVdd in 3.3v mode and OVDD/2 for all other I/O modes.
2. All maximum timing specifications assume CL = 50pF.
3. This minimum parameter assumes CL = 0pF.
4. tSYSCLK is the period of the external bus clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multiplied by the period of
SYSCLK to compute the actual time duration of the parameter in question.
5. Output signal transitions from GND to 2.0V or OVDD to 0.8V.
6. Nominal precharge width for ABB and DBB is 0.5 tSYSCLK.
7. Nominal precharge width for ARTRY is 1.0 tSYSCLK.
8. Guaranteed by design and characterization, and not tested.
9. L2_TSTCLK should be tied to OVDD.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC750L-FB0B350W | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B366W | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B375W | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0B400W | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25PPC750L-FB0C300W | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
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