參數(shù)資料
型號(hào): IBM25PPC750L-FB0B333W
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù): 33/46頁(yè)
文件大小: 610K
代理商: IBM25PPC750L-FB0B333W
9/30/99
Version 2.0
Datasheet
Page 35
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
The board designer can choose between several types of heat sinks to place on the PID8p-750. There are
several commercially-available heat sinks for the PID8p-750 provided by the following vendors:
Chip Coolers, Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Aavid Engineering
603-528-3400
One Kool Path
Laconic, NH 03247-0440
Wakefield Engineering
617-245-5900
60 Audubon Rd.
Wakefield, MA 01880
Ultimately, the final selection of an appropriate heat sink for the PID8p-750 depends on many factors, such as
thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
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