參數(shù)資料
型號(hào)： IBM25PPC750L-FB0B333W
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 38/46頁(yè)
文件大?。?/td> 610K
代理商： IBM25PPC750L-FB0B333W
9/30/99
Version 2.0
Datasheet
Page 39
PowerPC 750 SCM RISC Microprocessor
Preliminary Copy
PID8p-750
Assuming an air velocity of 0.5m/s, we have an effective
θ
SA of 7
°C/W, thus
T
J = 30
°C + 5°C + (2.2°C/W +1.0°C/W + 7°C/W) × 4.5W,
resulting in a junction temperature of approximately 81
°C which is well within the maximum operating temper-
ature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Aavid, and Wakefield Engineering offer different
heat sink-to-ambient thermal resistances, and may or may not need air flow.
Though the junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-
merit used for comparing the thermal performance of various microelectronic packaging technologies, one
should exercise caution when only using this metric in determining thermal management because no single
parameter can adequately describe three-dimensional heat flow. The final chip-junction operating tempera-
ture is not only a function of the component-level thermal resistance, but the system-level design and its oper-
ating conditions. In addition to the component's power dissipation, a number of factors affect the final
operating die-junction temperature. These factors might include air flow, board population (local heat flux of
adjacent components), heat sink efficiency, heat sink attach, next-level interconnect technology, system air
temperature rise, etc.
Figure 21. Thermalloy #2328B Pin-Fin Heat Sink-to-Ambient Thermal Resistance vs. Air ow Velocity
Approach Air Velocity (m/s)
Heat
Sink
Ther
mal
Resistance
(
×°
C/W)
1
2
3
4
5
6
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-n Heat Sink
(25 x 28 x 15 mm)
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