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參數資料
| 型號： | IBM25PPC750GLECR5HA3T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 |
| 封裝： | 21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件頁數： | 63/76頁 |
| 文件大?。?/td> | 1031K |
| 代理商： | IBM25PPC750GLECR5HA3T |
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Datasheet
IBM PowerPC 750GL RISC Microprocessor
DD1.X
Preliminary
System Design Information
Page 66 of 74
750GL_ds_body.fm 1.2
March 13, 2006
First, 750GL PD rises as TJ increases, so it is most useful to measure PD while the 750GL junction tempera-
ture is at maximum. While not specified or guaranteed, this rise in PD with TJ is typically less than 1 W per
10
°C. So regardless of other factors, the minimum cooling solution must have a maximum temperature rise of
no more than 10
°C/W. This minimum cooling solution is not generally achievable without a heat sink. A heat
sink or heat spreader of some sort must always be used in 750GL applications.
Second, due to process variations, there can be a significant variation in the PD of individual 750GL devices.
Finally, regardless of methodology, IBM only supports system designs that successfully maintain the
maximum junction temperature within the datasheet limits. IBM also supports designs that rely on the
maximum PD values given in this datasheet and supply a cooling solution sufficient to dissipate that amount
of power while keeping the maximum junction temperature below the maximum TJ.
5.6.3 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3-3, Package Thermal Characteristics, on
page 16, the intrinsic conduction thermal resistance paths illustrated in Figure 5-8 on page 67 are as follows:
Die junction-to-case thermal resistance (primary thermal path), defined as the thermal resistance from the
die junctions to the back (exposed) surface of the die.
Die junction-to-lead thermal resistance (not normally a significant thermal path), defined as the thermal
resistance from the die junctions to the circuit board interface.
Die junction-to-ambient thermal resistance (largely dependent on customer-supplied heat sink), defined
as the sum total of all the thermally conductive components that comprise the end user's application.
Ambient is further defined as the air temperature in the immediate vicinity of the thermally conductive
components, including the pre-heat contributions of surrounding heat sources.
Figure 5-8 on page 67 is a thermal model, in schematic form, of the primary heat transfer path for a package
with an attached heat sink mounted to a printed-circuit board.
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相關代理商/技術參數 |
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| IBM25PPC750GLECR5HB3T | 制造商:IBM 功能描述:IBMIBM25PPC750GLECR5HB3T LOGIC POWER PC 制造商:IBM 功能描述:32 BIT MPU - Trays |
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