參數(shù)資料
型號(hào): IBM25PPC750GLECR5HA3T
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292
封裝: 21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件頁(yè)數(shù): 24/76頁(yè)
文件大?。?/td> 1031K
代理商: IBM25PPC750GLECR5HA3T
Datasheet
IBM PowerPC 750GL RISC Microprocessor
DD1.X
Preliminary
Dimensions and Signal Assignments
Page 30 of 74
750GL_ds_body.fm 1.2
March 13, 2006
4. Dimensions and Signal Assignments
IBM offers a lead-reduced ceramic ball grid array (CBGA) that supports 292 balls for the 750GL package.
This is a signal and power compatible footprint to the PowerPC 750FX RISC Microprocessor module.
This section contains several views of the 750GL physical package and descriptions and listings of the
signals and ball/pin locations.
Use A01 corner designation for correct placement. Use the five plated dots that form a right angle (|_) to
locate the A01 corner as shown in Figure 4-1.
4.1 Package
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