參數(shù)資料
型號(hào)： IBM25PPC750GLECR5HA3T
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292
封裝： 21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件頁(yè)數(shù)： 62/76頁(yè)
文件大?。?/td> 1031K
代理商： IBM25PPC750GLECR5HA3T
Datasheet
IBM PowerPC 750GL RISC Microprocessor
Preliminary
DD1.X
750GL_ds_body.fm 1.2
March 13, 2006
System Design Information
Page 65 of 74
5.6.1 Thermal Assist Unit
IBM recommends that the thermal assist unit (TAU) in these devices be calibrated before use. Calibration
methods are discussed in the IBM application note, Calibrating the Thermal Assist Unit in the
IBM25PPC750L Processors. Although this note was written for the 750L, the calibration methods discussed
in this document also apply to the 750GL.
5.6.2 Minimum Heat Sink Requirements
The worst-case power dissipation (PD) for the 750GL is shown in Table 3-5, Power Consumption (Low
Power), on page 17. A conservative thermal management design will provide sufficient cooling to maintain
the junction temperature (TJ) of the 750GL below 105°C at maximum PD and worst-case ambient tempera-
ture and airflow conditions.
Many factors affect the 750GL power dissipation, including VDD, TJ, core frequency, process factors, and the
code that is running on the processor. In general, PD increases with increases in TJ, VDD, core frequency,
process variables, and the number of instructions executed per second.
For various reasons, a designer may determine that the power dissipation of the 750GL in their application
will be less than the maximum value shown in this datasheet. Assuming a lower PD will result in a thermal
management system with less cooling capacity than would be required for the maximum PD shown in the
datasheet. In this case, the designer may decide to determine the actual maximum 750GL PD in the particular
application. Contact your IBM PowerPC field applications engineer for more information.
In addition to the system factors that must be considered in a cooling system analysis, three things should be
noted.
Table 5-8. 750GL Heat-Sink Vendors
Company Names and Addresses for Heat-Sink Vendors
Chip Coolers, Inc.
333 Strawberry Field Rd.
Warwick, RI 02886
(800) 227-0254
International Electronic Research Corporation (IERC)
413 North Moss Street
Burbank, CA 91502
(818) 842-7277
Aavid Thermalloy
80 Commercial Street
Concord, NH 03301
(603) 224-9888
Wakefield Thermal Solutions Inc.
33 Bridge Street
Pellham, NH 03076
(603) 635-2800
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