參數(shù)資料
型號(hào): GCIXP1250-166
英文描述: Microprocessor
中文描述: 微處理器
文件頁(yè)數(shù): 19/148頁(yè)
文件大小: 1601K
代理商: GCIXP1250-166
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)當(dāng)前第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)
Intel
IXP1250 Network Processor
Datasheet
19
BootROM devices may be either 32 bits or 16 bits in width. This is determined by GPIO[3] during
reset. When 16-bit BootROM devices are used, the maximum BootROM address space is reduced
from 8 Mbytes to 4 Mbytes.
Figure 4
details the major components of the SRAM Unit.
The SRAM Bus consists of 19 address bits, 32 data bits, 4 chip enable bits, 8 buffer and read/write
control signals, a synchronous output clock (SCLK) running at one-half the IXP1250 Core
frequency, and a synchronous input clock (NA/SACLK). When using Flowthru SRAM types, it is
recommended to route the SCLK signal from the SRAMs back to the NA/SACLK input. Routing
this trace identically to the DQ data signals will skew the NA/SACLK slightly to track the return
data trace propagation delay. When using Pipelined/DCD SRAMs, the NA/SACLK input is not
used and may be held inactive with a pulldown to GND to save power.
The SRAM Unit receives memory requests from seven sources: the StrongARM* core and each of
the six Microengines. Refer to the IXP1250 Hardware Reference Manual for details on the
prioritization and queues provided for servicing these requests.
The IXP1250 supports the use of an optional asynchronous ready input for flexibility in interfacing
memory-mapped I/O devices to the SRAM Slowport region. This will allow the I/O device to add
wait-states to IXP1250 I/O accesses. This function is supported on the HIGH_EN_L pin. An I/O
device must drive HIGH_EN_L with a wired-OR open drain buffer configuration, and only drive
the pin when the I/O device is selected.
To use the RDY_L pin function, it must be enabled by setting SRAM_CSR[19]=1. The RDY_L
Pause State Value field located in register SRAM_SLOW_CONFIG[23:16] must be programmed
with the state value at which you choose to pause the internal wait-state logic. This pause state
relates to the other timing parameters programmed into the SRAM_SLOW_CONFIG and
Figure 4. SRAM Unit Block Diagram
A8545-01
AMBA[31:0]
(from
StrongARM*
Core)
Microengine
Commands &
Addresses
Microengine Data [63:0]
SRAM
32KB to
8MB
Pipelined-
DCD or
Flowthru
Buffer
SRAM
Pin
Interface
Command
Decoder
& Address
Generator
Service Priority
(Arbitration)
Machine & Registers
AMBA Bus
Interface
Logic
AMBA Address
Rd/Wr Queue
Microengine Address
& Command Queues
(High Priority, Read,
Readlock Fail
and Order)
Memory/
AMBA Data
FIFO
Addr[18:0]
Data[31:0]
RD/WR/EN
Signals
addr
data
* Other names and brands may be claimed as the property of others.
** ARM architecture compatible
BootROM
256KB
to
8 MB
Peripheral
Device
(i.e., MAC
CPU port)
SCLK
相關(guān)PDF資料
PDF描述
GCIXP1250-200 Microprocessor
GCIXP1250-232 Microprocessor
GCK101 Analog IC
GCK131 Microcontroller
GCM-3.15A Fuse
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GCIXP1250BA 功能描述:IC MPU NETWORK 166MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCIXP1250BB 功能描述:IC MPU NETWORK 200MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCIXP1250BC 功能描述:IC MPU NETWORK 232MHZ 520-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
GCJ0335C5C0JR50D 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors
GCJ0335C5C1AR50D 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors
<ins id="ocsv7"><label id="ocsv7"></label></ins>
  • <dl id="ocsv7"><span id="ocsv7"></span></dl>