- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄377002 > DSPB56007FJ50 DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC PDF資料下載
參數(shù)資料
| 型號(hào)： | DSPB56007FJ50 |
| 英文描述： | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| 中文描述： | 數(shù)字信號(hào)處理器| 24位|的CMOS | QFP封裝| 80腳|塑料 |
| 文件頁數(shù)： | 76/83頁 |
| 文件大?。?/td> | 382K |
| 代理商： | DSPB56007FJ50 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁當(dāng)前第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁
4-2
DSP56007/D
MOTOROLA
Design Considerations
Thermal Design Considerations
The thermal performance of plastic packages is more dependent on the temperature
of the PCB to which the package is mounted. Again, if the estimations obtained from
R
θ
JA
do not satisfactorily answer whether the thermal performance is adequate, a
system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the
junction-to-case thermal resistance in plastic packages:
To minimize temperature variation across the surface, the thermal resistance
is measured from the junction to the outside surface of the package (case)
closest to the chip mounting area when that surface has a proper heat sink.
To define a value approximately equal to a junction-to-board thermal
resistance, the thermal resistance is measured from the junction to where the
leads are attached to the case.
If the temperature of the package case (T
T
) is determined by a thermocouple,
the thermal resistance is computed using the value obtained by the equation
(T
J
– T
T
)/ P
D
.
As noted above, the junction-to-case thermal resistances quoted in this data sheet are
determined using the first definition. From a practical standpoint, that value is also
suitable for determining the junction temperature from a case thermocouple reading
in forced convection environments. In natural convection, using the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on
the case of the package will estimate a junction temperature slightly hotter than
actual temperature. Hence, the new thermal metric, Thermal Characterization
Parameter or
Ψ
JT
, has been defined to be (T
J
– T
T
)/ P
D
. This value gives a better
estimate of the junction temperature in natural convection when using the surface
temperature of the package. Remember that surface temperature readings of
packages are subject to significant errors caused by inadequate attachment of the
sensor to the surface and to errors caused by heat loss to the sensor. The
recommended technique is to attach a 40-gauge thermocouple wire and bead to the
top center of the package with thermally conductive epoxy.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DSPB56007FJ66 | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| DSPB56007FJ88 | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| DSPE56007FJ50 | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| DSPE56007FJ66 | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| DSPE56007FJ88 | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DSPB56007FJ66 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| DSPB56007FJ88 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| DSPB56011 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:24-BIT DVD DIGITAL SIGNAL PROCESSOR |
| DSPB56362AG120 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC LEAD FREE DSP56362 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSPB56362AG120 | 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor IC DSP Type:Cor |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。