參數(shù)資料
型號: DEMO9RS08KA2
廠商: Freescale Semiconductor
文件頁數(shù): 14/136頁
文件大?。?/td> 0K
描述: DEMO BOARD FOR 9RS08KA2
產(chǎn)品培訓(xùn)模塊: Mechatronics
USBSpyder08 Discovery Kit
RS08KA2 Low-End Microcontroller Series
MC9RS08KA8 Microcontroller
標(biāo)準(zhǔn)包裝: 1
系列: RS08
類型: MCU
適用于相關(guān)產(chǎn)品: MC9RS08KA2
所含物品: 板,線纜,CD,文檔,樣品 IC
產(chǎn)品目錄頁面: 730 (CN2011-ZH PDF)
相關(guān)產(chǎn)品: MC9RS08KA2CSCRTR-ND - IC MCU 8BIT 2K FLASH 8-SOIC
PC9RS08KA2PAE-ND - MCU 8BIT 2KB FLASH RS08 8-DIP
PC9RS08KA2FPE-ND - MCU 8BIT 2KB FLASH RS08 6-VDFN
PC9RS08KA2DWE-ND - MCU 8BIT 2KB FLASH RS08 8-SOIC
MC9RS08KA2CPC-ND - IC MCU 8-BIT 2K FLASH 8-PDIP
MC9RS08KA2CDB-ND - IC MCU 8-BIT 2K FLASH 6-DFN
MC9RS08KA2CSC-ND - IC MCU 8-BIT 2K FLASH 8-SOIC
Appendix A Electrical Characteristics
MC9RS08KA2 Series Data Sheet, Rev. 4
110
Freescale Semiconductor
A.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. A-1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
Table A-2. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJMAX
105
°C
Thermal resistance 1,2,3,4
6-pin DFN
1s
2s2p
8-pin PDIP
1s
2s2p
8-pin SOIC
1s
2s2p
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other
components on the board, and board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s - Single Layer Board, one signal layer
4 2s2p - Four Layer Board, 2 signal and 2 power layers
θ
JA
225
53
115
74
160
98
°C/W
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