參數(shù)資料
型號(hào): CY7C1381D-133BZXC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
中文描述: 512K X 36 CACHE SRAM, 6.5 ns, PBGA165
封裝: 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁(yè)數(shù): 25/29頁(yè)
文件大?。?/td> 477K
代理商: CY7C1381D-133BZXC
PRELIMINARY
CY7C1381D
CY7C1383D
Document #: 38-05544 Rev. *A
Page 25 of 29
Timing Diagrams
(continued)
tZZ
I
SUPPLY
CLK
ZZ
tZZREC
ALL INPUTS
(except ZZ)
DON’T CARE
IDDZZ
tZZI
tRZZI
Outputs (Q)
High-Z
DESELECT or READ Only
ZZ Mode Timing
[29, 30]
Ordering Information
Speed
(MHz)
133
Ordering Code
CY7C1381D-133AXC
CY7C1383D-133AXC
CY7C1381D-133BGC
CY7C1383D-133BGC
CY7C1381D-133BZC
CY7C1383D-133BZC
CY7C1381D-133BGXC
CY7C1383D-133BGXC
CY7C1381D-133BZXC
CY7C1383D-133BZXC
CY7C1381D-100AXC
CY7C1383D-100AXC
CY7C1381D-100BGC
CY7C1383D-100BGC
CY7C1381D-100BZC
CY7C1383D-100BZC
CY7C1381D-100BGXC
CY7C1383D-100BGXC
CY7C1381D-100BZXC
CY7C1383D-100BZXC
Package
Name
A101
Part and Package Type
Operating
Range
Commercial
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm) 3
Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and JTAG
BG119
BB165D
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
Lead-Free 119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables
and JTAG
Lead-Free 165-ball Fine-Pitch Ball Grid Array (13 x 15 x
1.4mm) 3 Chip Enables and JTAG
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm) 3
Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and JTAG
BG119
BB165D
100
A101
Commercial
BG119
BB165D
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
BG119
Lead-Free 119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables
and JTAG
BB165D
Lead-Free 165-ball Fine-Pitch Ball Grid Array (13 x 15 x
1.4mm) 3 Chip Enables and JTAG
Notes:
29.Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
30.DQs are in high-Z when exiting ZZ sleep mode.
相關(guān)PDF資料
PDF描述
CY7C1383D 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100AXC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100AXI 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100BGC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100BGI 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1381DV25-133AXC 制造商:Cypress Semiconductor 功能描述:
CY7C1381F-133BGC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381F-133BGCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381S-133AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 CY7C1381S-133AXC RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381XC 制造商:Cypress Semiconductor 功能描述: