參數(shù)資料
型號: CY7C1381D-133BZXC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
中文描述: 512K X 36 CACHE SRAM, 6.5 ns, PBGA165
封裝: 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁數(shù): 13/29頁
文件大小: 477K
代理商: CY7C1381D-133BZXC
PRELIMINARY
CY7C1381D
CY7C1383D
Document #: 38-05544 Rev. *A
Page 13 of 29
TAP AC Switching Characteristics
Over the operating Range
[9, 10]
3.3V TAP AC Test Conditions
Input pulse levels................................................ V
SS
to 3.3V
Input rise and fall times................................................... 1 ns
Input timing reference levels...........................................1.5V
Output reference levels...................................................1.5V
Test load termination supply voltage...............................1.5V
3.3V TAP AC Output Load Equivalent
2.5V TAP AC Test Conditions
Input pulse levels
......................................... V
SS
to 2.5V
Input rise and fall time .....................................................1 ns
Input timing reference levels.........................................1.25V
Output reference levels ................................................1.25V
Test load termination supply voltage ............................1.25V
2.5V TAP AC Output Load Equivalent
Notes:
9.
CS and
t
CH refer to the setup and hold time requirements of latching data from the boundary scan register.
10.Test conditions are specified using the load in TAP AC test Conditions. t
R
/t
F
= 1ns
Parameter
Description
Min.
Max.
Unit
Clock
t
TCYC
t
TF
t
TH
t
TL
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH time
TCK Clock LOW time
50
ns
MHz
ns
ns
20
25
25
Output Times
t
TDOV
t
TDOX
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
5
ns
ns
0
Set-up Times
t
TMSS
t
TDIS
t
CS
TMS Set-up to TCK Clock Rise
TDI Set-up to TCK Clock Rise
Capture Set-up to TCK Rise
5
5
5
ns
ns
Hold Times
t
TMSH
t
TDIH
t
CH
TMS hold after TCK Clock Rise
TDI Hold after Clock Rise
Capture Hold after Clock Rise
5
5
5
ns
ns
ns
TDO
1.5V
20pF
Z = 50
50
TDO
1.25V
20pF
Z = 50
50
相關(guān)PDF資料
PDF描述
CY7C1383D 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100AXC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100AXI 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100BGC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383D-100BGI 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1381DV25-133AXC 制造商:Cypress Semiconductor 功能描述:
CY7C1381F-133BGC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381F-133BGCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381S-133AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 CY7C1381S-133AXC RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381XC 制造商:Cypress Semiconductor 功能描述: