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參數(shù)資料
| 型號： | ADV7152 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | CMOS 220 MHz True-Color Graphics Triple 10-Bit Video RAM-DAC(三通道,10位視頻RAM-D/A轉換器) |
| 中文描述： | 220兆赫的CMOS真彩色圖形三路10位顯存，數(shù)模轉換器（三通道，10位視頻RAM的的D / A轉換器） |
| 文件頁數(shù)： | 25/32頁 |
| 文件大?。?/td> | 322K |
| 代理商： | ADV7152 |
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ADV7152
–31–
REV. B
APPENDIX 7
THERMAL AND ENVIRONMENTAL CONSIDERATIONS
Table A. Thermal Characteristics vs. Airflow
Air Velocity
0
50
100
200
(Linear feet/min)
(Still Air)
θ
JA (°C/W)
No Heatsink
35
31
28
25
EG&G D10100-28 Heatsink 32
28
25
22
Thermalloy 2290 Heatsink
25
21
18
15
Thermal Model
The junction temperature of the device in a specific application
is given by:
TJ = TA + PD (θJC + θCA)
(1)
or
TJ = TA + PD (
θ
JA)
(2)
where:
TJ = Junction Temperature of Silicon (°C)
TA = Ambient Temperature (
°C)
PD = Power Dissipation (W)
θ
JC = Junction to Case Thermal Resistance (°C/W)
θ
CA = Case to Ambient Thermal Resistance (
°C/W)
θ
JA = Junction to Ambient Thermal Resistance (
°C/W)
Package Enhancements
The standard QFP package has been enhanced to a PowerQuad2
package. This supports an improved thermal performance com-
pared to standard QFP. In this case the die is attached to the
heatslug so the power that is dissipated can be conducted to the
external surface of the package. This provides a highly efficient
path for the transfer of heat to the package surface. The package
configuration also provides an efficient thermal path from the
ADV7152 to the Printed Circuit Board via the leads.
Heatsinks
The maximum silicon junction temperature should be limited to
100
°C. Temperatures greater than this will reduce long term
device reliability. To ensure that the silicon junction tempera-
ture stays within prescribed limits, the addition of an external
heatsink may be necessary. Heatsinks, will reduce
θ
JA as shown
in the “Thermal Characteristics vs. Airflow” table.
The ADV7152 is a very highly integrated monolithic silicon
device. This high level of integration, in such a small package,
inevitably leads to consideration of thermal and environmental
conditions in which the ADV7152 must operate. Reliability of
the device is significantly enhanced by keeping it as cool as pos-
sible. In order to avoid destructive damage to the device, the
absolute maximum junction temperature of 150
°C must never
be exceeded. Certain applications, depending on pixel data
rates, may require forced air cooling or external heatsinks. The
following data is intended as a guide in evaluating the operating
conditions of a particular application so that optimum device
and system performance is achieved.
It should be noted that information on package characteristics pub-
lished herein may not be the most up to date at the time of reading
this. Advances in package compounds and manufacture will inevita-
bly lead to improvements in the thermal data. Please contact your
local sales office for the most up-to-date information.
Power Dissipation
The diagram shows graphs of power dissipation in watts vs.
pixel clock frequency for the ADV7152.
1.50
0.75
0.50
1.25
1.00
POWER
DISSIPATION
–
W
atts
V
AA = +5V
V
REF = +1.2V
T
A = 25°C
180
80
160
140
120
100
PIXEL CLOCK FREQUENCY – MHz
60
PIXEL CLOCK FREQUENCY – MHz
200
220
THE "TYPICAL ON-SCREEN PATTERN" CORRESPONDS TO LINEAR CHANGES IN THE
PIXEL INPUT (I. E., A BLACK TO WHITE RAMP). IN GENERAL, COLOR IMAGES TEND TO
APPROXIMATE THIS CHARACTERISTIC.
*
Typical Power Dissipation vs. Pixel Rate
Package Characteristics
The table of thermal characteristics shows typical information
for the ADV7152 (100-Lead Plastic Power QFP) using various
values of Airflow.
Junction to Case (
θ
JC) Thermal Resistance for this particular
part is:
θ
JC (100-Lead Plastic Power QFP) = 1.0
°C/W
(Note: 0
°C is independent of airflow.)
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| adv7152es | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Analog Devices 功能描述: |
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| ADV7152KS85 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Video DAC with Color Palette (RAMDAC) |
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