
DC and Logic Electrical Characteristics
(Continued)
The following specifications apply for GND = 0 V, V
D
= V
= PV
= +3.3 V
DC
, ADC Clock = 205 MHz, unless otherwise speci-
fied.
Boldface limits apply for T
A
= T
MIN
to T
MAX
;
all other limits T
A
= 25C.
Symbol
Parameter
Conditions
Min
(Note 9)
Typical
(Note 8)
38
40
57
13
14
18
320
330
390
8.4
28
Max
(Note 9)
Units
I
DD
I/O Supply Current
25C - 140 MSPS
25C - 170 MSPS
25C - 205 MSPS
25C - 140 MSPS
25C - 170 MSPS
25C - 205 MSPS
Full Temp. – 140 MSPS
Full Temp. – 170 MSPS
Full Temp. – 205 MSPS
Full Temp.
Full Temp.
mA
IP
VD
PLL Supply Current
mA
Total Power Dissipation
365
375
420
15
50
mA
Power Down Supply Current
Power Down Dissipation
mA
mW
Analog Channel Characteristics
The following specifications apply for GND = 0 V, V
= V
DD
= PV
D
= +3.3 V
, V
= +3.3 V
, ADC Clock = 205 MHz, un-
less otherwise specified.
Boldface limits apply for T
A
= T
MIN
to T
MAX
;
all other limits T
A
= 25C (Note 7).
Symbol
Parameter
Conditions
Min
(Note 9)
Typical
(Note 8)
500
2
1.5
44
43.5
43.5
44
43.5
43.5
50
Max
(Note 9)
Units
Analog Bandwidth, Full Power
Transient Response
Overvoltage Recovery Time
Signal to Noise Ratio
(Without Harmonics)
25C
25C
25C
25C – 140 MSPS
25C –170 MSPS
25C –205 MSPS
Full temp. – 140 MSPS
Full Temp. – 170 MSPS
Full Temp. – 205 MSPS
Full Temp.
MHz
ns
ns
dB
SNR
40.7
40.7
40.5
SNR
Signal to Noise Ratio
(Without Harmonics)
dB
Crosstalk
dBc
THERMAL CHARACTERISTICS
θ
JC
Junction to Case Thermal
Resistance
θ
JA
Junction to Ambient Thermal
Resistance
12.3
C/W
30.2
C/W
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2:
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
Note 3:
When the input voltage (V
IN
) at any pin exceeds the power supplies (V
IN
<
GND or V
IN
>
V
A
or V
D
), the current at that pin should be limited to 25 mA.
The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25
mA to two.
Note 4:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
,
θ
JA
and the ambient temperature, T
A
. The maximum
allowable power dissipation at any temperature is P
D
= (T
JMAX
– T
A
)/
θ
JA
. T
JMAX
= 150C for this device. The typical thermal resistance (
θ
JA
) of this part when board
mounted is TBD C/W for the VLA128A 128 pin PQFP package.
Note 5:
Human body model is 100 pF capacitor discharged through a 1.5 k
resistor. Machine model is 200 pF discharged through a 0
resistor.
Note 6:
Soldering process must comply with National Semiconductor’s reflow temperature profile specifications. Refer to "www.national.com/packaging".
Note 7:
Two diodes clamp the OS analog inputs to AGND and V
A
as shown below. This input protection, in combination with the external clamp capacitor and the
output impedance of the video source, prevents damage to the ADCS9888 from transients during power-up.
A
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10