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參數(shù)資料
| 型號： | XC3SD1800A-4CSG484LI |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 7/101頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA SPARTAN 3 DSP 484CSGBGA |
| 標準包裝： | 84 |
| 系列： | Spartan®-3A DSP |
| LAB/CLB數(shù)： | 4160 |
| 邏輯元件/單元數(shù)： | 37440 |
| RAM 位總計： | 1548288 |
| 輸入/輸出數(shù)： | 309 |
| 門數(shù)： | 1800000 |
| 電源電壓： | 1.14 V ~ 1.26 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 484-FBGA，CSPBGA |
| 供應商設備封裝： | 484-CSPBGA |
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Spartan-3A DSP FPGA Family: DC and Switching Characteristics
DS610 (v3.0) October 4, 2010
Product Specification
13
Quiescent Current Requirements
Table 9: Quiescent Supply Current Characteristics(1)
Symbol
Description
Device
Power
Typical(2)
Commercial
Maximum(2)
Industrial
Maximum(2)
Units
ICCINTQ
Quiescent VCCINT supply current
XC3SD1800A
C,I
41
390
500
mA
LI
36
–
175
mA
XC3SD3400A
C,I
64
550
725
mA
LI
55
–
300
mA
ICCOQ
Quiescent VCCO supply current
XC3SD1800A
C,I
0.4
4
5
mA
LI
0.2
–5
mA
XC3SD3400A
C,I
0.4
4
5
mA
LI
0.2
–5
mA
ICCAUXQ Quiescent VCCAUX supply current
XC3SD1800A
C,I
25
90
110
mA
LI
24
–72
mA
XC3SD3400A
C,I
39
130
160
mA
LI
38
–
105
mA
Notes:
1.
The numbers in this table are based on the conditions set forth in Table 7.
2.
Quiescent supply current is measured with all I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads
disabled. Typical values are characterized using typical devices at room temperature (TJ of 25°C at VCCINT = 1.2V, VCCO = 3.3V, and VCCAUX
= 2.5V). The maximum limits are tested for each device at the respective maximum specified junction temperature and at maximum voltage
limits with VCCINT = 1.26V, VCCO = 3.6V, and VCCAUX = 3.6V. The FPGA is programmed with a “blank” configuration data file (that is, a design
with no functional elements instantiated). For conditions other than those described above (for example, a design including functional
elements), measured quiescent current levels will be different than the values in the table.
3.
For more accurate estimates for a specific design, use the Xilinx XPower tools. There are two recommended ways to estimate the total power
consumption (quiescent plus dynamic) for a specific design: a) The Spartan-3A DSP FPGA XPower Estimator provides quick, approximate,
typical estimates, and does not require a netlist of the design. b) XPower Analyzer uses a netlist as input to provide maximum estimates as
well as more accurate typical estimates.
4.
The maximum numbers in this table indicate the minimum current each power rail requires in order for the FPGA to power-on successfully.
5.
For information on the power-saving Suspend mode, see XAPP480: Using Suspend Mode in Spartan-3 Generation FPGAs. Suspend mode
typically saves 40% total power consumption compared to quiescent current.
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相關代理商/技術參數(shù) |
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| XC3SD1800A-4FG676C | 制造商:Xilinx 功能描述:FPGA SPARTAN-3A 1.8M GATES 37440 CELLS 667MHZ 1.2V 676FBGA - Trays 制造商:Xilinx 功能描述:IC FPGA 519 I/O 676FBGA 制造商:Xilinx 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA |
| XC3SD1800A-4FG676I | 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A DSP 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
| XC3SD1800A-4FGG676C | 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A DSP 標準包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應商設備封裝:208-PQFP（28x28） |
| XC3SD1800A-4FGG676CES | 制造商:Xilinx 功能描述: |
| XC3SD1800A-4FGG676I | 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3A DSP 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA（27x27） |
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