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參數(shù)資料
| 型號： | XC4062XL-09HQ240C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 1/16頁 |
| 文件大小： | 0K |
| 描述： | IC FPGA C-TEMP 3.3V 240-HQFP |
| 產(chǎn)品變化通告： | Product Discontinuation 19/Feb/2007 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | XC4000E/X |
| LAB/CLB數(shù)： | 2304 |
| 邏輯元件/單元數(shù)： | 5472 |
| RAM 位總計： | 73728 |
| 輸入/輸出數(shù)： | 193 |
| 門數(shù)： | 62000 |
| 電源電壓： | 3 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 240-BFQFP 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 240-PQFP（32x32） |
R
DS005 (v2.0) March 1, 2013 - Product Specification
6-73
XC4000E and XC4000X Series Field Programmable Gate Arrays
6
Product Obsolete/Under Obsolescence
XC4000XL Electrical Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance:
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device
families. Values are subject to change. Use as estimates, not for production.
Preliminary:
Based on preliminary characterization. Further changes are not expected.
Unmarked:
Specifications not identified as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions.
All specifications subject to change without notice.
XC4000XL D.C. Characteristics
Absolute Maximum Ratings
Recommended Operating Conditions
Description
Units
VCC
Supply voltage relative to Ground
-0.5 to 4.0
V
VIN
Input voltage relative to Ground (Note 1)
-0.5 to 5.5
V
VTS
Voltage applied to 3-state output (Note 1)
-0.5 to 5.5
V
VCCt
Longest Supply Voltage Rise Time from 1 V to 3V
50
ms
TSTG
Storage temperature (ambient)
-65 to +150
°C
TSOL
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
+260
°C
TJ
Junction Temperature
Ceramic packages
+150
°C
Plastic packages
+125
°C
Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to
achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot toVCC +2.0 V, provided this over or
undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended
periods of time may affect device reliability.
Symbol
Description
Min
Max
Units
VCC
Supply voltage relative to Gnd, TJ = 0 °C to +85°C
Commercial
3.0
3.6
V
Supply voltage relative to Gnd, TJ = -40°C to +100°C Industrial
3.0
3.6
V
VIH
High-level input voltage
50% of VCC
5.5
V
VIL
Low-level input voltage
0
30% of VCC
V
TIN
Input signal transition time
250
ns
Notes:
At junction temperatures above those listed above, all delay parameters increase by 0.35% per
°C.
Input and output measurement threshold is ~50% of VCC.
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