參數(shù)資料
型號: TSPC860
廠商: Atmel Corp.
英文描述: Integrated Communication Processor
中文描述: 綜合通信處理器
文件頁數(shù): 88/93頁
文件大?。?/td> 1601K
代理商: TSPC860
88
TSPC860 [Preliminary]
2129B–HIREL–12/04
Figure 76.
Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
25
0.2
B
22.6
22.4
(22.86)
Bottom view
4X
(22.86)
18X 1.27
0.9
0.6
1 2 3 4 5 6 7 8 910111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.03
0.15
A B C
A
0.35
19
18
17
U
V
W
M
M
0.25 A
0.2 A
2.52
2.1
A
A
357X
A1 Index
Top view
25
C
22.6
22.4
Notes:
1. All dimensions in millimeters
2. Dimensions and tolerance per
ASME Y14.5M, 1994
3. Maximum solder ball diameter measured
parallel to Datum A
Side view
1.2
1.1
0.7
0.5
0.62
0.5
357X
Seating
plane
+
18X 1.27
3
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