參數(shù)資料
型號: STR912FAW32H6T
廠商: 意法半導體
英文描述: ARM966E-S⑩ 16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA
中文描述: ARM966E -虜⑩16/32位閃存微控制器與以太網(wǎng),USB,加拿大,交流電機控制,4個定時器,模數(shù)轉(zhuǎn)換器,RTC和DMA的
文件頁數(shù): 95/99頁
文件大小: 979K
代理商: STR912FAW32H6T
STR91xFAx32 STR91xFAx42 STR91xFAx44
Package mechanical data
95/99
9.2
Thermal characteristics
The average chip-junction temperature, T
J
must never exceed 125° C.
The average chip-junction temperature, T
J
, in degrees Celsius, may be calculated using the
following equation:
T
J
= T
A
+ (P
D
x
Θ
JA
)(1)
Where:
T
A
is the Ambient Temperature in
°
C,
Θ
JA
is the Package Junction-to-Ambient Thermal Resistance, in
°
C/W,
P
D
is the sum of P
INT
and P
I/O
(P
D
= P
INT
+ P
I/O
),
P
INT
is the product of I
DD
and
V
DD
, expressed in Watts. This is the Chip
Internal Power.
P
I/O
represents the Power Dissipation on Input and Output Pins;
Most of the time for the applications P
I/O
<
P
INT
and may be neglected. On the other hand,
P
I/O
may be significant if the device is configured to drive continuously external modules
and/or memories. The worst case P
INT
of the STR91xFA is 500mW (I
DD
x V
DD
, or 250mA x
2.0V).
An approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is given by:
P
D
= K / (T
J
+ 273°C) (2)
Therefore (solving equations 1 and 2):
K = P
D
x (T
A
+ 273°C) +
Θ
JA
x P
D2
(3)
where:
K is a constant for the particular part, which may be determined from
equation (3) by measuring P
D
(at equilibrium) for a known T
A.
Using this
value of K, the values of P
D
and T
J
may be obtained by solving
equations (1) and (2) iteratively for any value of T
A
.
Table 49.
Thermal characteristics
Symbol
Parameter
Value
Unit
Θ
JA
Thermal Resistance Junction-Ambient
LQFP 80 - 12 x 12 mm / 0.5 mm pitch
41.5
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
LQFP128 - 14 x 14 mm / 0.4 mm pitch
38
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
36.5
°C/W
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相關代理商/技術參數(shù)
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