參數(shù)資料
型號(hào): SP37E760-MD
廠商: STANDARD MICROSYSTEMS CORP
元件分類: 外設(shè)及接口
英文描述: 3.3 V I/O CONTROLLER FOR EMBEDDED APPLICATIONS
中文描述: MULTIFUNCTION PERIPHERAL, PQFP100
封裝: TQFP-100
文件頁(yè)數(shù): 76/78頁(yè)
文件大?。?/td> 510K
代理商: SP37E760-MD
SMSC DS – SP37E760
Page 76
Rev. 04/13/2001
10 PACKAGE OUTLINES
FIGURE 17 – 100 PIN QFP
0.1
0
-
C-
H
A
A1
A2
TD/
TE
0
L
1
L
E1
E
D
1
D
e
W
Notes:
1) Coplanarity is 0.100mm (.004") maximum.
2) Tolerance on the position of the leads is
0.200mm (.008") maximum.
3) Package body dimensions D1 and E1 do not
include the mold protrusion. Maximum mold
protrusion is 0.25mm (.010").
4) Dimensions TD and TE are important for testing
by robotic handler. Only above combinations of (1)
or (2) are acceptable.
5) Cin inches for reference only and not
necessarily
accurate.
D IM
A
A1
A2
D
D1
E
E1
H
L
L1
e
0
W
TD(1
)
TE(1)
)
TE(2)
MIN
2.80
0.1
2.57
23.4
19.9
17.4
13.9
0.1
0.65
1.8
MA X
3.15
0.45
2.87
24.15
20.1
18.15
14.1
0.2
0.95
2.6
MIN
.110
.004
.101
.921
.783
.685
.547
.004
.026
.071
MA X
.124
.018
.113
.951
.791
.715
.555
.008
.037
.102
.2
21.8
15.8
22.21
16.27
12°
.4
22.2
16.2
22.76
16.82
0.65 BSC
.008
.858
.622
.874
.641
12°
.016
.874
.638
.896
.662
.0256 BSC
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