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| 型號(hào)： | PPC440SP-RNC667C |
| 廠商： | APPLIEDMICRO INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | PowerPC 440SP Embedded Processor |
| 中文描述： | 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783 |
| 封裝： | 29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783 |
| 文件頁(yè)數(shù)： | 66/85頁(yè) |
| 文件大?。?/td> | 615K |
| 代理商： | PPC440SP-RNC667C |
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PowerPC 440SP Embedded Processor
66
AMCC Proprietary
Revision 1.23 - Sept 26, 2006
Data Sheet
Input Max Allowable Overshoot (3.3V LVTTL)
V
IMAO
+3.9
V
Input Max Allowable Undershoot (3.3V LVTTL)
V
IMAU
-0.6
V
Output Max Allowable Overshoot (3.3V LVTTL)
V
OMAO
+3.9
V
Output Max Allowable Undershoot (3.3V
LVTTL)
V
OMAU3
-0.6
V
Case Temperature
T
C
-40
+100
°
C
6
Notes:
1. PCI-X drivers meet PCI-X specifications.
2. SV
REF
= SV
DD
/2
3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
PPC440SP. See “Absolute Maximum Ratings” on page 63.
4. Power supply sequencing: It is recommended that the 1.5V Vdd of the core reach its nominal value before applying power to the
I/Os. Voltage applied to I/Os from an external source must not be allowed to exceed the 0Vdd ramp. A power down cycle must
complete (0Vdd and Vdd are below 0.4V) before a new power up cycle is started.
5. LPDL is least positive down level; MPUL is most positive up level.
6. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
Table 10. Input Capacitance
Parameter
Symbol
Maximum
Unit
Notes
Group 1 (2.5V SSTL I/O)
C
IN1
5.2
pF
Group 2 (3.3V LVTTL I/O)
C
IN2
7.1
pF
Group 3 (PCI-X I/O)
C
IN3
5.7
pF
Group 4 (Receivers)
C
IN4
6.9
pF
Group 5 (3.3V tolerant CMOS I/O)
C
IN5
3.4
pF
Table 9. Recommended DC Operating Conditions (Sheet 3 of 3)
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes
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