- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄296641 > MT18VDVF6472DG-265XX 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 PDF資料下載
參數(shù)資料
| 型號(hào)： | MT18VDVF6472DG-265XX |
| 元件分類： | DRAM |
| 英文描述： | 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 |
| 封裝： | DIMM-184 |
| 文件頁數(shù)： | 25/38頁 |
| 文件大?。?/td> | 713K |
| 代理商： | MT18VDVF6472DG-265XX |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁當(dāng)前第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁
PDF: 09005aef81c73825/Source: 09005aef81c73837
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF18C64_128x72D_2.fm - Rev. A 8/05 EN
31
2003, 2004, 2005 Micron Technology, Inc. All rights reserved.
512MB, 1GB: (x72, DR) 184-Pin DDR VLP RDIMM
Temperature and Air Flow Specifications
Figure 11:
Component Case Temperature vs. Air Flow
Notes: 1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM)
across all modules.
2. The component case temperature measurements shown above were obtained experimen-
tally. The typical system to be used for experimental purposes is a dual-processor 600 MHz
work station, fully loaded, with four comparable registered memory modules. Case tem-
peratures charted represent worst-case component locations on modules installed in the
internal slots of the system.
3. Temperature versus air speed data is obtained by performing experiments with the system
motherboard removed from its case and mounted in a Eiffel-type low air speed wind tun-
nel. Peripheral devices installed on the system motherboard for testing are the proces-
sor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel
test chamber.
4. The memory diagnostic software used for determining worst-case component tempera-
tures is a memory diagnostic software application developed for internal use by Micron
Technology, Inc.
20
30
40
50
60
70
80
90
100
0.0
0.5
1.0
2.0
Air Flow (meters/sec)
Degrees
Celsius
Ambient Temperature = 25 C
Tmax- memory stress software
Tave- 3D gaming software
Tave- memory stress software
Minimum Air Flow
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MT2S3216D-20 | 32K X 16 MULTI DEVICE SRAM MODULE, 20 ns, DMA40 |
| MT46H256M32LFCM-5:A | 256M X 32 DDR DRAM, 5 ns, PBGA90 |
| MT46H256M32L2JV-75IT:A | 256M X 32 DDR DRAM, 6 ns, PBGA168 |
| MT46H256M32L4CM-54IT:A | 256M X 32 DDR DRAM, 5 ns, PBGA90 |
| MT46H256M32L4MC-54AT:A | 256M X 32 DDR DRAM, 5 ns, PBGA240 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT-19 | 功能描述:TERM BARRIER 19CIRC DUAL ROW RoHS:是 類別:連接器，互連式 >> 接線座 - 隔板塊 系列:M 標(biāo)準(zhǔn)包裝:10 系列:Beau™ 38780 端接塊類型:阻隔塊 電路數(shù):15 導(dǎo)線入口數(shù)目:30 間距:0.438"（11.12mm） 行數(shù):2 電流:15A 電壓:300V 線規(guī):14-22 AWG 頂部端子:螺釘 底部端子:焊片 阻擋層類型:雙壁（雙） 特點(diǎn):法蘭 顏色:黑 包裝:散裝 安裝類型:通孔 工作溫度:- 材料 - 絕緣體:聚對(duì)苯二甲酸丁二酯（PBT），玻璃纖維增強(qiáng)型 材料可燃性額定值:UL94 V-0 其它名稱:038780-111538780-1115387801115 |
| MT190A | 制造商:Black Box Corporation 功能描述:SMART 64K CSU/DSU |
| MT190AD130 | 制造商:BLACK BOX 功能描述:64K CSU/DSU |
| MT190A-D48 | 制造商:Black Box Corporation 功能描述:Smart 64K CSU/DSUs, 24 48-VDC |
| MT190A-D48-W1 | 制造商:Black Box Corporation 功能描述:1 YEAR WARRANTY FOR MT190A-D48 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。