參數(shù)資料
型號(hào): MPC8313E-RDBC
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 61/99頁(yè)
文件大?。?/td> 0K
描述: BOARD CPU 8313E VER 2.2
標(biāo)準(zhǔn)包裝: 1
系列: PowerQUICC II™ PRO
類(lèi)型: MPU
適用于相關(guān)產(chǎn)品: MPC8313E
所含物品:
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
64
Freescale Semiconductor
19.2
Mechanical Dimensions of the MPC8313E TEPBGAII
This figure shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII
package.
Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Package code 5368 is to account for PGE and the built-in heat spreader.
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