參數(shù)資料
型號： MPC8313E-RDBC
廠商： Freescale Semiconductor
文件頁數(shù)： 17/99頁
文件大小： 0K
描述： BOARD CPU 8313E VER 2.2
標(biāo)準(zhǔn)包裝： 1
系列： PowerQUICC II™ PRO
類型： MPU
適用于相關(guān)產(chǎn)品： MPC8313E
所含物品： 板
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
24
Freescale Semiconductor
This figure shows the MII transmit AC timing diagram.
Figure 8. MII Transmit AC Timing Diagram
8.2.1.2
MII Receive AC Timing Specifications
This table provides the MII receive AC timing specifications.
This figure provides the AC test load for TSEC.
Figure 9. TSEC AC Test Load
Table 27. MII Receive AC Timing Specifications
At recommended operating conditions with LVDDA/LVDDB/NVDD of 3.3 V ± 0.3 V.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
—400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—40—
ns
RX_CLK duty cycle
tMRXH/tMRX
35
—
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
ns
RX_CLK clock rise VIL(min) to VIH(max)
tMRXR
1.0
—
4.0
ns
RX_CLK clock fall time VIH(max) to VIL(min)
tMRXF
1.0
—
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data
input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in
general, the clock reference symbol representation is based on three letters representing the clock of a particular functional.
For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention
is used with the appropriate letter: R (rise) or F (fall).
2. The frequency of RX_CLK should not exceed the TX_CLK by more than 300 ppm
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
Output
Z0 = 50
LVDDA/2 or LVDDB/2
RL = 50
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