- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369923 > MPC5200ID (Motorola, Inc.) MPC5200 Hardware Specifications PDF資料下載
參數(shù)資料
| 型號： | MPC5200ID |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC5200 Hardware Specifications |
| 中文描述： | MPC5200的硬件規(guī)格 |
| 文件頁數(shù)： | 11/76頁 |
| 文件大小： | 1404K |
| 代理商： | MPC5200ID |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁當(dāng)前第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁
MOTOROLA
MPC5200 Hardware Specifications
11
Electrical and Thermal Characteristics
R
θ
JA
= R
θ
JC
+R
θ
CA
Eqn. 2
where:
R
θ
JA
= junction to ambient thermal resistance (oC/W)
R
θ
JC
= junction to case thermal resistance (oC/W)
R
θ
CA
= case to ambient thermal resistance (oC/W)
R
θ
JC
is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, R
θ
CA
. For instance, the user can change the air flow
around the device, add a heat sink, change the mounting arrangement on printed circuit board, or change
the thermal dissipation on the printed circuit board surrounding the device. This description is most useful
for ceramic packages with heat sinks where some 90% of the heat flow is through the case to the heat sink
to ambient. For most packages, a better model is required.
A more accurate thermal model can be constructed from the junction to board thermal resistance and the
junction to case thermal resistance
1-3
. The junction to case covers the situation where a heat sink will be
used or where a substantial amount of heat is dissipated from the top of the package. The junction to
board thermal resistance describes the thermal performance when most of the heat is conducted to the
printed circuit board. This model can be used for either hand estimations or for a computational fluid
dynamics (CFD) thermal model.
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (
Ψ
JT
) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
T
J
= T
T
+(
Ψ
JT
×
P
D
)
Eqn. 3
where:
T
T
= thermocouple temperature on top of package (oC)
Ψ
JT
= thermal characterization parameter (oC/W)
P
D
= power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned, so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over approximately one mm of wire extending from the junction. The
thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling
effects of the thermocouple wire.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC555 | Highly Integrated, Low-Power, 32-Bit Microcontroller |
| MPC561 | RISC MCU Including Peripheral Pin Multiplexing with Flash and Code Compression Options |
| MPC561MZP56 | RISC MCU Including Peripheral Pin Multiplexing with Flash and Code Compression Options |
| MPC562 | RISC MCU Including Peripheral Pin Multiplexing with Flash and Code Compression Options |
| MPC562MZP56 | RISC MCU Including Peripheral Pin Multiplexing with Flash and Code Compression Options |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5200VR400 | 功能描述:微處理器 - MPU NO-PB COMM 5200 400MHZ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5200VR400B | 功能描述:微處理器 - MPU HABANERO COMM PBFREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5200VR400BR2 | 功能描述:IC MPU 32BIT 400MHZ 272-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MPC52xx 標(biāo)準(zhǔn)包裝:1 系列:AVR® ATmega 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，SPI，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):32 程序存儲器容量:32KB（16K x 16） 程序存儲器類型:閃存 EEPROM 大小:1K x 8 RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:44-TQFP 包裝:剪切帶 (CT) 其它名稱:ATMEGA324P-B15AZCT |
| MPC52100J | 功能描述:厚膜電阻器 - 透孔 RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk |
| MPC52100J | 制造商:TE Connectivity 功能描述:RESISTOR 5W 10R |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。